Effect of sputtering process parameters on film properties of molybdenum back contact von Pethe, Shirish A., Takahashi, Eigo, Kaul, Ashwani, Dhere, Neelkanth G.

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ZnxCd1−xS as a heterojunction partner for CuIn1−xGaxS2 thin film solar cells von Kumar, Bhaskar, Vasekar, Parag, Pethe, Shirish A., Dhere, Neelkanth G., Koishiyev, Galymzhan T.

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Correlation between preparation parameters and properties of molybdenum back contact layer for CIGS thin film solar cell von Takahashi, Eigo, Pethe, Shirish A, Dhere, Neelkanth G

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Effect of sputtering process parameters on film properties of molybdenum back contact : Photovoltaics, Solar Energy Materials, and Technologies: Cancun 2010 von PETHE, Shirish A, TAKAHASHI, Eigo, KAUL, Ashwani, DHERE, Neelkanth G

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Recent advances in electroplating based CIGS solar cell fabrication von Aksu, S., Pethe, S., Kleiman-Shwarsctein, A., Kundu, S., Pinarbasi, M.

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Zn x Cd 1 − x S as a heterojunction partner for CuIn 1 − x Ga xS 2 thin film solar cells von Kumar, Bhaskar, Vasekar, Parag, Pethe, Shirish A., Dhere, Neelkanth G., Koishiyev, Galymzhan T.

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Long-term performance study of united solar PV modules in hot and humid climate of Florida von Dhere, N. G., Kaul, A., Pethe, S. A.

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Comparative study of various PV technologies in terms of energy yield and annual degradation von Dhere, N G, Pethe, S A, Kaul, A

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Photovoltaic module reliability studies at the Florida Solar Energy Center von Dhere, N G, Pethe, S A, Kaul, A

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ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GAP FILL von CEN, Xi, WU, Kai, SASAKI, Nobuyuki, LEI, Wei, TAEWOONG, Yun, PETHE, Shirish A

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BUFFER LAYER FOR DIELECTRIC PROTECTION IN PHYSICAL VAPOR DEPOSITION METAL LINER APPLICATIONS von GAO, Xingyao, LEI, Yu, LEI, Wei, PATEL, Sahil, PETHE, Shirish A

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Buffer Layer for Dielectric Protection in Physical Vapor Deposition Metal Liner Applications von GAO, Xingyao, LEI, Yu, LEI, Wei, PATEL, Sahil, PETHE, Shirish A

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METHOD OF DEPOSITING LAYERS von PETHE, Shirish, ZHANG, Fuhong, LI, Rui, XIE, Xiangjin, TANG, Xianmin, LEE, Joung Joo

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ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GAP FILL von CEN, Xi, WU, Kai, SASAKI, Nobuyuki, LEI, Wei, TAEWOONG, Yun, PETHE, Shirish A

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ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GAP FILL von CEN, Xi, WU, Kai, SASAKI, Nobuyuki, LEI, Wei, TAEWOONG, Yun, PETHE, Shirish A

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Method of depositing multilayer stack including copper over features of a device structure von Pethe, Shirish, Lee, Joung Joo, Tang, Xianmin, Li, Rui, Xie, Xiangjin, Zhang, Fuhong

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Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill von Xu, Yi, Lei, Wei, Ha, Tae Hong, Lei, Yu, Hung, Raymond, Pethe, Shirish A

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Methods and apparatus for forming dual metal interconnects von Lee, Joung Joo, Pethe, Shirish, Shaviv, Roey, Gage, David, Ganguli, Seshadri, Tang, Jianshe, Stolfi, Michael A, Parikh, Suketu A, Tao, Rong

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Methods and apparatus for filling a feature disposed in a substrate von Pethe, Shirish, Tang, Xianmin, Zhong, Lanlan, Li, Rui, Xie, Xiangjin, Zhang, Fuhong, Allen, Adolph

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Methods and apparatus for semi-dynamic bottom up reflow von Lee, Joung Joo, Tang, Xianmin, Zhong, Lanlan, Kalathiparambil, Kishor, Pethe, Shirish A, Xie, Xiangjin, Zhang, Fuhong

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