Mobility of black pigments for electrophoretic display depending on the characteristics of carbon sphere von Lee, Kang Uk, Kim, Myung Jun, Park, Kyung Ju, Kim, Myeongho, Kim, Jae Jeong

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Preparation of black pigment with the Couette–Taylor vortex for electrophoretic displays von Kim, Myeongho, Park, Kyung Ju, Lee, Kang Uk, Kim, Myung Jun, Kim, Woo-Sik, Kwon, Oh Joong, Kim, Jae Jeong

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Carbon sphere as a black pigment for an electronic paper von Lee, Kang Uk, Park, Kyung Ju, Kwon, Oh Joong, Kim, Jae Jeong

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Degradation of poly(ethylene glycol–propylene glycol) copolymer and its influences on copper electrodeposition von Choe, Seunghoe, Kim, Myung Jun, Kim, Hoe Chul, Lim, Taeho, Park, Kyung Ju, Kim, Kwang Hwan, Ahn, Sang Hyun, Lee, Anna, Kim, Soo-Kil, Kim, Jae Jeong

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Preparation of the carbon sphere coated with iron oxide and its application for electronic paper von Lee, Kang Uk, Park, Kyung Ju, Kim, Myeong Ho, Kwon, Oh Joong, Kim, Jae Jeong

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Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement von Park, Kyung Ju, Koo, Hyo-Chol, Lim, Taeho, Kim, Myung Jun, Kwon, Oh Joong, Kim, Jae Jeong

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Preparation of PS/TiO2 as a white pigment for electrophoretic displays von Park, Kyung Ju, Lee, Kang Uk, Kim, Myeong Ho, Kwon, Oh Joong, Kim, Jae Jeong

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The effect of inducing uniform Cu growth on formation of electroless Cu seed layer von Lim, Taeho, Kim, Myung Jun, Park, Kyung Ju, Kim, Kwang Hwan, Choe, Seunghoe, Lee, Young-Soo, Kim, Jae Jeong

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Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films von Kim, Hoe Chul, Kim, Myung Jun, Lim, Taeho, Park, Kyung Ju, Kim, Kwang Hwan, Choe, Seunghoe, Kim, Soo-Kil, Kim, Jae Jeong

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Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent von Kim, Kwang Hwan, Lim, Taeho, Park, Kyung Ju, Koo, Hyo-Chol, Kim, Myung Jun, Kim, Jae Jeong

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The Effect of Intravenous Infiltration Management Program for Hospitalized Children von Park, Soon Mi, Jeong, Ihn Sook, Kim, Kyoung Lae, Park, Kyung Ju, Jung, Moon Ju, Jun, Seong Sook

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Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film von Kim, Myung Jun, Park, Kyung Ju, Lim, Taeho, Kwon, Oh Joong, Kim, Jae Jeong

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Catalytic growth of a colloidal carbon sphere by hydrothermal reaction with iron oxide (Fe3O4) catalyst von Lee, Kang Uk, Kim, Myung Jun, Park, Kyung Ju, Kim, Myeongho, Kwon, Oh Joong, Kim, Jae Jeong

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Local Buckling Coefficient of Thin-Walled Pultruded FRP Compression Members von Joo, Joo Hyung, Yoon, Soon Jong, Park, Ju Kyung, Cho, Sun Kyu

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Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection: I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling von Kim, Myung Jun, Lim, Taeho, Park, Kyung Ju, Kim, Soo-Kil, Kim, Jae Jeong

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Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization von Kim, Hoe Chul, Kim, Myung Jun, Choe, Seunghoe, Lim, Taeho, Park, Kyung Ju, Kim, Kwang Hwan, Ahn, Sang Hyun, Kim, Soo-Kil, Kim, Jae Jeong

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Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection: II. Enhancement of Cu Superfilling and Leveling von Kim, Myung Jun, Lim, Taeho, Park, Kyung Ju, Kim, Soo-Kil, Kim, Jae Jeong

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One-Pot Synthesis of PdAu-Au Core-Shell Bimetallic Nanoparticles Using Electrodeposition and Their Optical Property von Kim, Myung Jun, Park, Kyung Ju, Lim, Taeho, Choe, Seunghoe, Yu, Taekyung, Kim, Jae Jeong

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Superfilling of Cu-Ag Using Electrodeposition in Cyanide-Based Electrolyte von Kim, Myung Jun, Yong, Sang Heon, Ko, Hyun Seok, Lim, Taeho, Park, Kyung Ju, Kwon, Oh Joong, Kim, Jae Jeong

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Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films: I. Effects of the Anodic Step in the Absence of an Organic Additive von Kim, Myung Jun, Lim, Taeho, Park, Kyung Ju, Cho, Sung Ki, Kim, Soo-Kil, Kim, Jae Jeong

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