Reliability evaluation of adhesive bonded SMT components in industrial applications von Périchaud, M.G., Delétage, J.Y., Frémont, H., Danto, Y., Faure, C.

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The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies von Ousten, Y., Mejdi, S., Fenech, A., Deletage, J.Y., Bechou, L., Perichaud, M.G., Danto, Y.

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[formula omitted] Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment von Vandamme, L.K.J., Perichaud, M.G., Noguera, E., Danto, Y., Behner, U.

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1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds von Vandamme, L.K.J., Perichaud, M.G., Noguera, E., Danto, Y., Behner, U.

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Thermomechanical behaviour of adhesive jointed SMT components von Perichaud, M.G., Deletage, J.Y., Carboni, D., Fremont, H., Danto, Y., Faure, C.

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Growth undercooling in multi-crystalline pure silicon and in silicon containing light impurities (C and O) von Riberi-Béridot, T., Tsoutsouva, M.G., Regula, G., Reinhart, G., Périchaud, I., Baruchel, J., Mangelinck-Noël, N.

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The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies von Ousten, Y., Mejdi, S., Fenech, A., Deletage, J.Y., Bechou, L., Perichaud, M.G., Danto, Y.

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