Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications von Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Bristow, J.P., Yue Liu, Peczalski, A., Rowlette, J., Plotts, A., Stack, J., Kadar-Kallen, M., Yardley, J., Eldada, L., Osgood, R.M., Scarmozzino, R., Lee, S.H., Ozgus, V., Patra, S.

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