Market pricing of banks’ fair value assets reported under SFAS 157 since the 2008 financial crisis von Goh, Beng Wee, Li, Dan, Ng, Jeffrey, Ow Yong, Kevin

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Impact of Basel III on the discretion and timeliness of Banks’ loan loss provisions von Jutasompakorn, Pearpilai, Lim, Chu Yeong, Ranasinghe, Tharindra, Ow Yong, Kevin

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The Effect of Board Independence on Information Asymmetry von Goh, Beng Wee, Lee, Jimmy, Ng, Jeffrey, Ow Yong, Kevin

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Regulatory pressure and income smoothing by banks in response to anticipated changes to the Basel II Accord von Lim, Chu Yeong, Yong, Kevin Ow

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A new perspective on post‐earnings‐announcement‐drift: Using a relative drift measure von Clement, Michael, Lee, Joonho, Yong, Kevin Ow

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Valuation Implications of FAS 159 Reported Gains and Losses From Fair Value Accounting for Liabilities von Chung, Sung Gon, Lee, Cheol, Lobo, Gerald J., Yong, Kevin Ow

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Voluntary fair value disclosures beyond SFAS 157’s three-level estimates von Chung, Sung Gon, Goh, Beng Wee, Ng, Jeffrey, Yong, Kevin Ow

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An Examination of the Statistical Significance and Economic Relevance of Profitability and Earnings Forecasts from Models and Analysts von Evans, Mark E., Njoroge, Kenneth, Yong, Kevin Ow

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The effect of Statement of Financial Accounting Standards No. 157 Fair Value Measurements on analysts’ information environment von Barron, Orie E., Chung, Sung Gon, Yong, Kevin Ow

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Trust in Fair Value Accounting: Evidence from the Field von Goh, Clarence, Lim, Chu Yeong, Ng, Jeffrey, Pan, Gary, Yong, Kevin Ow

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Regulatory pressure and income smoothing by banks in response to anticipated changes to the Basel Ⅱ Accordq von Chu Yeong Lim Kevin Ow Yong

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Theory and practice of the proposed conceptual framework: Evidence from the field von Yong, Kevin Ow, Lim, Chu Yeong, Tan, Pearl

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Semiconductor chip package fixture von Lim, Kevin W, Too, Seah S, Nayan, Azlina N, Keok, Kee Hean, Yong, Soon Tatt Ow

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Semiconductor chip package fixture von KEOK KEE HEAN, LIM KEVIN W, YONG SOON TATT OW, TOO SEAH S, NAYAN AZLINA N

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Semiconductor Chip Package Fixture von KEOK KEE HEAN, LIM KEVIN W, YONG SOON TATT OW, TOO SEAH S, NAYAN AZLINA N

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