Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design von Vianello, E., Thomas, O., Harrand, M., Onkaraiah, S., Cabout, T., Traore, B., Diokh, T., Oucheikh, H., Perniola, L., Molas, G., Blaise, P., Nodin, J. F., Jalaguier, E., De Salvo, B.

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