New layer transfers obtained by the SmartCut process von MORICEAU, H, FOURNEL, F, SOUBIE, A, BIASSE, B, SOUSBIE, N, SARTORI, S, MICHAUD, J. F, LETERTRE, F, RAYSSAC, O, CAYREFOURCQ, I, RICHTARCH, C, DAVAL, N, ASPAR, B, AULNETTE, C, AKATSU, T, OSTERNAUD, B, GHYSELEN, B, MAZURE, C, BATAILLOU, B, BEAUMONT, A, MORALES, C, CARTIER, A. M, POCAS, S, LAGAHE, C, JALAGUIER, E

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Strain characterization of strained silicon on insulator wafers von Paillard, V, Ghyselen, B, Aulnette, C, Osternaud, B, Daval, N, Fournel, F, Moriceau, H, Ernst, T, Hartmann, J.M, Lagahe-Blanchard, C, Pocas, S, Leduc, P, Vincent, L, Cristiano, F, Campidelli, Y, Kermarrec, O, Besson, P, Morand, Y

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Engineering strained silicon on insulator wafers with the Smart CutTM technology von Ghyselen, B., Hartmann, J.-M., Ernst, T., Aulnette, C., Osternaud, B., Bogumilowicz, Y., Abbadie, A., Besson, P., Rayssac, O., Tiberj, A., Daval, N., Cayrefourq, I., Fournel, F., Moriceau, H., Di Nardo, C., Andrieu, F., Paillard, V., Cabié, M., Vincent, L., Snoeck, E., Cristiano, F., Rocher, A., Ponchet, A., Claverie, A., Boucaud, P., Semeria, M.-N., Bensahel, D., Kernevez, N., Mazure, C.

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Engineering strained silicon on insulator wafers with the Smart Cut TM technology von Ghyselen, B., Hartmann, J.-M., Ernst, T., Aulnette, C., Osternaud, B., Bogumilowicz, Y., Abbadie, A., Besson, P., Rayssac, O., Tiberj, A., Daval, N., Cayrefourq, I., Fournel, F., Moriceau, H., Di Nardo, C., Andrieu, F., Paillard, V., Cabié, M., Vincent, L., Snoeck, E., Cristiano, F., Rocher, A., Ponchet, A., Claverie, A., Boucaud, P., Semeria, M.-N., Bensahel, D., Kernevez, N., Mazure, C.

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