Influence of Complexing Agents on Adhesion Strength of Electroless Nickel–Phosphorus Plating to Silicon Nitride–Aluminum–Polyimide Mixed Substrates von Arakawa, Tomiyuki, Watanabe, Nobuaki, Nakada, Tatsunosuke, Oshikiri, Junki, Umemoto, Hiroshi, Hashimoto, Akira, Koiwa, Ichiro

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Infrared Absorption Films Developed by Copper Electroplating with Chemical Etching and Subsequent Blackening von ARAKAWA, Tomiyuki, WATANABE, Nobuaki, OSHIKIRI, Junki, KOIWA, Ichiro

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High Adhesion Plating on Smooth Resin Surfaces Using a High-power UV Lamp von Oshikiri, Junki, Kosuge, Atushi, Iimori, Yousuke, Watanabe, Mituhiro, Honma, Hideo, Takai, Osamu

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Infrared Absorption Films Developed by Copper Electroplating with Chemical Etching and Subsequent Blackening von ARAKAWA, Tomiyuki, WATANABE, Nobuaki, OSHIKIRI, Junki, KOIWA, Ichiro

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Optimization of Pretreatment Conditions for Electroless Ni-P Plating Simultaneously on Various Substrates for High Density Packaging von NAKADA, Tatsunosuke, WATANABE, Nobuaki, OSHIKIRI, Junki, HASHIMOTO, Akira, KOIWA, Ichiro

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高密度実装応用を目的とした種々の基板材料への無電解Ni-Pめっきの前処理とその条件の最適化 von 中田, 龍之介, 渡辺, 宣朗, 押切, 絢貴, 橋本, 晃, 小岩, 一郎

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