Application of hardness-by-design methodology to radiation-tolerant ASIC technologies von Lacoe, R.C., Osborn, J.V., Koga, R., Brown, S., Mayer, D.C.

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CEPPAD: Comprehensive energetic particle and pitch angle distribution experiment on POLAR von Blake, J. B., Fennell, J. F., Friesen, L. M., Johnson, B. M., Kolasinski, W. A., Mabry, D. J., Osborn, J. V., Penzin, S. H., Schnauss, E. R., Spence, H. E., Baker, D. N., Belian, R., Fritz, T. A., Ford, W., Laubscher, B., Stiglich, R., Baraze, R. A., Hilsenrath, M. F., Imhof, W. L., Kilner, J. R., Mobilia, J., Voss, D. H., Korth, A., G ll, M., Fisher, K., Grande, M., Hall, D.

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Dose-rate sensitivity of modern nMOSFETs von Witczak, S.C., Lacoe, R.C., Osborn, J.V., Hutson, J.M., Moss, S.C.

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Total dose hardness of three commercial CMOS microelectronics foundries von Osborn, J.V., Lacoe, R.C., Mayer, D.C., Yabiku, G.

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A TID and SEE Radiation-Hardened, Wideband, Low-Noise Amplifier von Mossawir, B., Linscott, I.R., Inan, U.S., Roeder, J.L., Osborn, J.V., Witczak, S.C., King, E.E., LaLumondiere, S.D.

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CRRES magnetic electron spectrometer AFGL-701-5A (MEA) von Vampola, A. L, Osborn, J. V, Johnson, B. M

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Reliability enhancement in high-performance MOSFETs by annular transistor design von Mayer, D.C., Lacoe, R.C., King, E.E., Osborn, J.V.

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Displacement Damage in TiO Memristor Devices von DeIonno, E., Looper, M. D., Osborn, J. V., Palko, J. W.

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SEU test techniques for 256K static RAMs and comparisons of upsets induced by heavy ions and protons von Koga, R, Kolasinski, W A, Osborn, J V, Elder, J H, Chitty, R

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Wavelength dependence of transient laser-induced latchup in epi-CMOS test structures von LaLumondiere, S.D., Koga, R., Osborn, J.V., Mayer, D.C., Lacoe, R.C., Moss, S.C.

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Stroboscopic Imaging Interferometer for MEMS Performance Measurement von Conway, J.A., Osborn, J.V., Fowler, J.D.

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Si3N4 extrinsic defects and capacitor reliability von Scarpulla, J, King, E E, Osborn, J V

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Fabrication, characterization, and thermal failure analysis of a micro hot plate chemical sensor substrate von WEILLER, Bruce H, FUQUA, Peter D, OSBORN, Jon V

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DEFOLIANT COMPOSITION AND METHOD von TURNER, IV OSBORN J, HICKEY JOSEPH A, GAYTAN JESSE H

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Defoliant composition and method von TURNER, IV OSBORN J, HICKEY JOSEPH A, GAYTAN JESSE H

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Defoliant composition and method von Gaytan, Jesse H, Hickey, Joseph A, Turner, IV, Osborn J

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Solid formulation of low melting active compound von SECKINGER, C. STEPHEN, GAYTAN, JESSE H, TURNER IV, OSBORN J

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Stroboscopic Imaging Interferometer for MEMS Performance Measurement von Conway, J A, Osborn, J V, Fowler, J D

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SOLID FORMULATION OF LOW MELTING ACTIVE COMPOUND von SECKINGER C. STEPHEN, TURNER, IV OSBORN J, GAYTAN JESSE H

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SEU test techniques for 256 K static RAMs and comparisons of upsets by heavy ions and protons von Koga, R., Kolasinski, W.A., Osborn, J.V., Elder, J.H., Chitty, R.

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