Treffer 1 - 4 von 4 für Suche 'Ooyoshi, Takafumi', Suchdauer: 0,36s Treffer weiter einschränken
  1. 1
    Effect of underfill on electromigration lifetime in flip chip joints

    Effect of underfill on electromigration lifetime in flip chip joints von Yamanaka, Kimihiro, Ooyoshi, Takafumi, Nejime, Takayuki

    Veröffentlicht in Journal of alloys and compounds

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  2. 2
    Temperature measurement at flip chip solder joint during electromigration test

    Temperature measurement at flip chip solder joint during electromigration test von Yamanaka, Kimihiro, Ooyoshi, Takafumi, Nejime, Takayuki


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  3. 3
    Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates

    Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates von Yamanaka, Kimihiro, Fujisaki, Teruya, Ichinose, Manabu, Ooyoshi, Takafumi


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  4. 4
    Effect of solders, underfills and substrates on the reliability of flip-chip bonding of low-k semiconductor chips

    Effect of solders, underfills and substrates on the reliability of flip-chip bonding of low-k semiconductor chips von Terada, K, Nejime, T, Ooyoshi, T, Kobayashi, K, Yamanaka, K


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