LEAD FRAME, METHOD FOR MANUFACTURING A LEAD FRAME AND SEMICONDUCTOR DEVICE WITH A LEAD FRAME von LING, Mooi Hiong, OOI, Chee-Eng, ITHNAIN, Ismail

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Component having boundary element von Prakash, Rajah, Lim, Choo Kean, Ooi, Chee-Eng, Betthausen, Christian, Chan, Weng Heng, Ithnain, Ismail, Wong, Teik Yee, Soong, Chee Weng

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CARRIER AND OPTOELECTRONIC COMPONENT von OOI, Chee Eng, CHAN, Weng Heng, LIM, Choo Kean, ITHNAIN, Ismail

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METHOD OF MANUFACTURING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT von Lin-Lefebvre, I-Hsin, Ooi, Chee Eng, Streitel, Reinhard, Galesic, Ivan

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Component Having Boundary Element von Prakash, Rajah, Lim, Choo Kean, Ooi, Chee-Eng, Betthausen, Christian, Chan, Weng Heng, Ithnain, Ismail, Wong, Teik Yee, Soong, Chee Weng

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Bauelement mit Begrenzungselement von Prakash, Rajah, Lim, Choo Kean, Ooi, Chee-Eng, Betthausen, Christian, Chan, Weng Heng, Ithnain, Ismail, Wong, Teik Yee, Soong, Chee Weng

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Optoelektronisches Bauelement und Verfahren zum Herstellen des optoelektronischen Bauelements von Ooi, Chee Eng, Stoll, Ion, Galesic, Ivan

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OPTOELECTRONIC COMPONENT AND A METHOD FOR PRODUCING THE OPTOELECTRONIC COMPONENT von GALESIC, IVAN, STOLL, ION, OOI, CHEE ENG

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Bauelement mit Begrenzungselement von Prakash, Rajah, Lim, Choo Kean, Ooi, Chee-Eng, Betthausen, Christian, Chan, Weng Heng, Ithnain, Ismail, Wong, Teik Yee, Soong, Chee Weng

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METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT von OOI, Chee Eng, LIN-LEFEBVRE, I-Hsin, STREITEL, Reinhard, GALESIC, Ivan

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Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement von Galesic, Ivan, Dr, Ooi, Chee Eng, Lin, I-Hsin, Streitel, Reinhard

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Chipträger, elektronisches Bauelement mit Chipträger und Verfahren zur Herstellung eines Chipträgers von CHANG, SENG-TEONG, OOI, CHEE-ENG

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CHIP CARRIER, ELECTRONIC COMPONENT HAVING A CHIP CARRIER, AND METHOD FOR PRODUCING A CHIP CARRIER von CHANG, SENG-TEONG, OOI, CHEE-ENG

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Semiconductor component e.g. laser diode chip has contact portion that is provided for externally and electrically contacting semiconductor component with bonding compound, and pat... von GOH, GIM-WAE, SEE, HONG-PENG, CHANG, SENG-TEONG, OOI, CHEE-ENG

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Multiple configuration stackable instrument modules von YEAP BOON L.,FOO SHIEW F.,LIM CHEE B.,TAY ENG S.,OOI AIK K

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Multiple configuration stackable instrument modules von YEAP BOON L.,FOO SHIEW F.,LIM CHEE B.,TAY ENG S.,OOI AIK K

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Loss of Karma transposon methylation underlies the mantled somaclonal variant of oil palm von Ong-Abdullah, Meilina, Ordway, Jared M., Jiang, Nan, Ooi, Siew-Eng, Kok, Sau-Yee, Sarpan, Norashikin, Azimi, Nuraziyan, Hashim, Ahmad Tarmizi, Ishak, Zamzuri, Rosli, Samsul Kamal, Malike, Fadila Ahmad, Bakar, Nor Azwani Abu, Marjuni, Marhalil, Abdullah, Norziha, Yaakub, Zulkifli, Amiruddin, Mohd Din, Nookiah, Rajanaidu, Singh, Rajinder, Low, Eng-Ti Leslie, Chan, Kuang-Lim, Azizi, Norazah, Smith, Steven W., Bacher, Blaire, Budiman, Muhammad A., Van Brunt, Andrew, Wischmeyer, Corey, Beil, Melissa, Hogan, Michael, Lakey, Nathan, Lim, Chin-Ching, Arulandoo, Xaviar, Wong, Choo-Kien, Choo, Chin-Nee, Wong, Wei-Chee, Kwan, Yen-Yen, Alwee, Sharifah Shahrul Rabiah Syed, Sambanthamurthi, Ravigadevi, Martienssen, Robert A.

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Stacked Planar Inverted-L Antenna With Enhanced Capacitance for Compact Tag Design von Ooi, Shin-Yi, Chee, Pei-Song, Lim, Eng-Hock, Lee, Yong-Hong, Bong, Fwee-Leong

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Reconfiguring the radiology leadership team for crisis management during the COVID-19 pandemic in a large tertiary hospital in Singapore von Tay, Kiang Hiong, Ooi, Chin Chin, Mahmood, Muhammad Illyyas Bin, Aw, Lian Ping, Chan, Lai Peng, Ng, David Chee Eng, Tan, Bien Soo

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Gate‐Defined Quantum Confinement in CVD 2D WS2 von Lau, Chit Siong, Chee, Jing Yee, Cao, Liemao, Ooi, Zi‐En, Tong, Shi Wun, Bosman, Michel, Bussolotti, Fabio, Deng, Tianqi, Wu, Gang, Yang, Shuo‐Wang, Wang, Tong, Teo, Siew Lang, Wong, Calvin Pei Yu, Chai, Jian Wei, Chen, Li, Zhang, Zhong Ming, Ang, Kah‐Wee, Ang, Yee Sin, Goh, Kuan Eng Johnson

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