ISHM news von Binner, H, Law, H.T, Sinnadurai, N, Jones, G, Ongley, P.E

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Plasma Treatment in Hybrid and Conventional Electronic Assemblies von Booth, R.N, Ongley, P.E

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Plasma Desmearing of Multilayer Boards von Ongley, P.E.

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Innovations in thermoplastic die attach adhesives for microelectronic packaging von Corbett, S., Ongley, P.E.

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Underfill encapsulant technology for flip chip assembly von Gilleo, K., Nicholls, G., Ongley, P.E.

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A prototype de-focussed confocal Fabry-Perot spherical interferometer (DFPS) von Smith, R.C., Abdul-Rahman, Y.A., Beesley, G.W., Bell, F.T., Ongley, P.E.

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