Substrate-Induced Noise Model and Parameter Extraction for High-Frequency Noise Modeling of Sub-Micron MOSFETs von Shih Ni Ong, Kiat Seng Yeo, Chew, Kok Wai Johnny, Chan, Lye Hock Kelvin

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Microlens array produced using hot embossing process von Ong, N.S, Koh, Y.H, Fu, Y.Q

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Effects of surface roughness on microinjection molding von Zhang, H.L., Ong, N.S., Lam, Y.C.

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Impact of velocity saturation and hot carrier effects on channel thermal noise model of deep sub-micron MOSFETs von Ong, S.N., Yeo, K.S., Chew, K.W.J., Chan, L.H.K., Loo, X.S., Boon, C.C., Do, M.A.

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A new field dependent mobility model for high frequency channel thermal noise of deep submicron RFCMOS von Ong, S.N., Yeo, K.S., Chew, K.W.J., Chan, L.H.K., Loo, X.S., Boon, C.C., Do, M.A.

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A Cascade-Parallel Based Noise De-Embedding Technique for RF Modeling of CMOS Device von Loo, X. S., Yeo, K. S., Chew, K. W. J., Chan, L. H. K., Ong, S. N., Do, M. A., Boon, C. C.

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Experimental investigation of key parameters on the effects of cavity surface roughness in microinjection molding von Zhang, H.L., Ong, N.S., Lam, Y.C.

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Automatic Subassembly Detection from a Product Model for Disassembly Sequence Generation von Ong, N. S., Wong, Y. C.

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Gas-assisted injection molding: the effects of process variables and gas channel geometry von Parvez, M.A., Ong, N.S., Lam, Y.C., Tor, S.B.

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Mold surface roughness effects on cavity filling of polymer melt in micro injection molding von Zhang, H. L., Ong, N. S., Lam, Y. C.

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Manufacturing cost estimation for PCB assembly: An activity-based approach von Ong, N.S.

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A New Millimeter-Wave Fixture Deembedding Method Based on Generalized Cascade Network Model von Loo, X. S., Yeo, K. S., Chew, K. W. J., Chan, L. H. K., Ong, S. N., Do, M. A., Boon, C. C.

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MOSFET Drain Current Noise Modeling With Effective Gate Overdrive and Junction Noise von Chan, L. H. K., Yeo, K. S., Chew, K. W. J., Ong, S. N., Loo, X. S., Boon, C. C., Do, M. A.

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EFFECT OF TEMPERATURE AND INLET VELOCITY ON THE FLOW OF A NONNEWTONIAN FLUID von Koh, Y.H., Ong, N.S., Chen, X.Y., Lam, Y.C., Chai, J.C.

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PCB assembly planning using genetic algorithms von Khoo, L. P., Ong, N. S.

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Activity-based cost tables to support wire harness design von Ong, N.S.

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An Expert System Approach to Product Design for Manufacture and Assembly von N S ONG

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High Speed Blanking:An Economical Way of Producing Parts von ONG N. S.

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Numerical simulation of cavity roughness effects on melt filling in microinjection molding von Ong, N. S., Zhang, H. L., Lam, Y. C.

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SARS in Singapore: surveillance strategies in a globalising city von Teo, Peggy, Yeoh, Brenda S.A., Ong, Shir Nee

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