Novel technology for microlenses for imaging applications von Motsnyi, Vasyl, De Wolf, Ingrid, Rochus, Veronique, Rottenberg, Xavier, Cangar, Ozlem, Van Olmen, Jan, Guerrieri, Stefano, De Moor, Piet, Zahir, Mustapha

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Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors von Malinowski, Pawel E, Georgitzikis, Epimitheas, Maes, Jorick, Vamvaka, Ioanna, Frazzica, Fortunato, Van Olmen, Jan, De Moor, Piet, Heremans, Paul, Hens, Zeger, Cheyns, David

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Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance von Katti, Guruprasad, Stucchi, Michele, Van Olmen, Jan, De Meyer, Kristin, Dehaene, Wim

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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology von Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P

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Novel technology for microlenses for imaging applications von Motsnyi, Vasyl, De Wolf, Ingrid, Rochus, Veronique, Rottenberg, Xavier, Cangar, Ozlem, Van Olmen, Jan, Guerrieri, Stefano, De Moor, Piet, Zahir, Mustapha

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Thin-film quantum dot photodiode for monolithic infrared image sensors von Malinowski, Pawel E, Georgitzikis, Epimitheas, Maes, Jorick, Vamvaka, Ioanna, Frazzica, Fortunato, Van Olmen, Jan, De Moor, Piet, Heremans, Paul, Hens, Zeger, Cheyns, David

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On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance von Travaly, Y., Mandeep, B., Carbonell, L., Tokei, Z., Van Olmen, J., Iacopi, F., Van Hove, M., Stucchi, M., Maex, K.

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On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes von Cavaco, Celso, Peng, Lan, Sebaai, Farid, Verbinnen, Greet, Visker, Jakob, Olmen, Jan, Tezcan, Deniz Sabuncuoglu, Osman, Haris

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Design issues and considerations for low-cost 3D TSV IC technology von Van der Plas, G., Limaye, P., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Guruprasad, K., Velenis, D., Shinichi, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie, R., Perry, D., Bronckers, S., Minas, N., Cupac, M., Ruythooren, W., Van Olmen, J., Phommahaxay, A., de Potter de ten Broeck, M., Opdebeeck, A., Rakowski, M., De Wachter, B., Dehan, M., Nelis, M., Agarwal, R., Dehaene, W., Travaly, Y., Marchal, P., Beyne, E.

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Advanced Technologies for In-Line and Post-Processed TSV Integration von Beyne, Eric O., Swinnen, Bart, Van Olmen, Jan, Tezcan, Deniz S.

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Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding von Huyghebaert, Cedric, Van Olmen, Jan, Civale, Yann, Phommahaxay, Alain, Jourdain, Anne, Sood, Sumant, Farrens, Shari, Soussan, Philippe

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Method for producing interconnect structures for integrated circuits von Huyghebaert, Cedric, Van Olmen, Jan, Vaes, Jan

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Monolithic near infrared image sensors enabled by quantum dot photodetector von Malinowski, Pawel E, Georgitzikis, Epimitheas, Maes, Jorick, Mamun, Mehedi, Enzing, Oscar, Frazzica, Fortunato, Van Olmen, Jan, De Moor, Piet, Heremans, Paul, Hens, Zeger, Cheyns, David

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On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes von Cavaco, Celso, Peng, Lan, Sebaai, Farid, Verbinnen, Greet, Visker, Jakob, Olmen, Jan, Tezcan, Deniz Sabuncuoglu, Osman, Haris

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Method for producing interconnect structures for integrated circuits von VAES JAN, HUYGHEBAERT CEDRIC, VAN OLMEN JAN

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Method for producing interconnect structures for integrated circuits von Huyghebaert, Cedric, Vaes, Jan, Van Olmen, Jan

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Method for producing interconnect structures for integrated circuits von VAES, JAN, VAN OLMEN, JAN, HUYGHEBAERT, CEDRIC

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Alternative dual damascene patterning approach von VAN HOVE, MARLEEN, STRUYF, HERBERT, VAN OLMEN, JAN, HENDRICKX, DIRK, BOULLART, WERNER, VANHAELEMEERSCH, SERGE

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METHOD FOR PRODUCING INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS von VAES JAN, HUYGHEBAERT CEDRIC, VAN OLMEN JAN

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Method for producing interconnect structures for integrated circuits von VAES, JAN, VAN OLMEN, JAN, HUYGHEBAERT, CEDRIC

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