A Cu-Cu Wire-Bonding Enabled by a Cu-Selective Passivation Coating to Enhance Packaging Reliability von Alptekin, John, Antony Jesu Durai, Kevin, Kumaravel, Dinesh Kumar, Estridge, Logan, Chyan, Oliver, Ibrahim, Rusli, Li, Guangming, Mathew, Varughese

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Thin-film UV–vis spectroscopy as a chemically-sensitive monitoring tool for copper etching bath von Lambert, Alexander, Asokan, Muthappan, Issac, Goutham, Love, Casey, Chyan, Oliver

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Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly von Ashok Kumar, Goutham Issac, Lambert, Alexander, Caperton, Joshua, Asokan, Muthappan, Yi, William, Chyan, Oliver

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A New Class of Thin Film Hydrogels Produced by Plasma Polymerization von Bhattacharyya, Dhiman, Pillai, Karthikeyan, Chyan, Oliver M. R, Tang, Liping, Timmons, Richard B

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Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application von Ashok Kumar, Goutham Issac, Alptekin, John, Caperton, Joshua, Salunke, Ashish, Chyan, Oliver

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UV-Assisted Modification and Removal Mechanism of a Fluorocarbon Polymer Film on Low‑k Dielectric Trench Structure von Mukherjee, Tamal, Berhe, Seare A, Goswami, Arindom, Chyan, Oliver, Singh, Kanwal Jit, Brown, Ian

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Ion-Induced Phase Changes in 2D MoTe 2 Films for Neuromorphic Synaptic Device Applications von Rupom, Rifat Hasan, Jung, Moonyoung, Pathak, Anil, Park, Jeongmin, Lee, Eunho, Ju, Hyeon-Ah, Kim, Young-Min, Chyan, Oliver, Kim, Jungkwun, Suh, Dongseok, Choi, Wonbong

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Ion-Induced Phase Changes in 2D MoTe2 Films for Neuromorphic Synaptic Device Applications von Rupom, Rifat Hasan, Jung, Moonyoung, Pathak, Anil, Park, Jeongmin, Lee, Eunho, Ju, Hyeon-Ah, Kim, Young-Min, Chyan, Oliver, Kim, Jungkwun, Suh, Dongseok, Choi, Wonbong

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Enhancement of the energy photoconversion efficiency through crystallographic etching of a c-plane GaN thin film von Basilio, Antonio M., Hsu, Yu-Kuei, Tu, Wen-Hsun, Yen, Cheng-Hsuing, Hsu, Geng-Ming, Chyan, Oliver, Chyan, Yieu, Hwang, Jih-Shang, Chen, Yit-Tsong, Chen, Li-Chyong, Chen, Kuei-Hsien

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Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability von Durai, Kevin Antony Jesu, Kumaravel, Dinesh Kumar, Alptekin, John, Estridge, Logan, Nair, Shyam, Chyan, Oliver

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Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments von Ross, Nick, Asokan, Muthappan, Ashok Kumar, Goutham Issac, Caperton, Joshua, Alptekin, John, Salunke, Ashish Shivaji, Chyan, Oliver M.

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Pulsed Plasma Polymerization of Tetramethyltin:  Nanoscale Compositional Control of Film Chemistry von Chen, Xiaolan, Rajeshwar, Krishnan, Timmons, Richard B, Chen, Jin-Jian, Chyan, Oliver M. R

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Electrodeposition of copper thin film on ruthenium: A potential diffusion barrier for Cu interconnects von CHYAN, Oliver, ARUNAGIRI, Tiruchirapalli N, PONNUSWAMY, Thomas

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Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability von Salunke, Ashish S., Alptekin, John, Akula, Kaushik, Jayakumar, Subiksha, Kumar, Shaurya, Chyan, Oliver

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Photochemically Induced Metallization of Surface Silicon Using Dinuclear Metal Carbonyl Compounds. Anchoring of Ruthenium to a Si(111) Surface through Covalent Ru−Si Bond Formation... von Nalla, Praveen, Huang, Zhang, Yibin, Chyan, Oliver, Richmond, Michael G, El Bouanani, Mohamed

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Ultrafine Platinum Nanoparticles Uniformly Dispersed on Arrayed CNx Nanotubes with High Electrochemical Activity von SUN, Chia-Liang, CHEN, Li-Chyong, SU, Ming-Chuan, HONG, Lu-Sheng, CHYAN, Oliver, HSU, Chien-Yu, CHEN, Kuei-Hsien, CHANG, Te-Fu, CHANG, Li

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Electrodeposition of Copper Thin Film on Ruthenium von Chyan, Oliver, Arunagiri, Tiruchirapalli N., Ponnuswamy, Thomas

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Metal Electrodeposition on an Integrated, Screen-Printed Electrode Assembly von Chyan, Yieu, Chyan, Oliver

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Study of Pyrazole as Copper Corrosion Inhibitor in Alkaline Post Chemical Mechanical Polishing Cleaning Solution von Goswami, Arindom, Koskey, Simon, Mukherjee, Tamal, Chyan, Oliver

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Copper deposition of HF etched silicon surfaces : morphological and kinetic studies von CHYAN, O. M. R, JIN-JIAN CHEN, CHIEN, H. Y, SEES, J, HALL, L

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