Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices von Miki, Takuji, Nagata, Makoto, Sonoda, Hiroki, Miura, Noriyuki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya

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3-D CMOS Chip Stacking for Security ICs Featuring Backside Buried Metal Power Delivery Networks With Distributed Capacitance von Monta, Kazuki, Sonoda, Hiroki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya, Miura, Noriyuki, Miki, Takuji, Nagata, Makoto

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Packaged semiconductor device von TAKEMURA, SEIJI, KAWAI, MASATAKA, OKIDONO, TAKAAKI, HAMADA, TOMOMI

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IC card including multiple substrates bearing electronic components von ONODA, SHIGEO, ARITA, TAKASHI, NISHINO, KIYOTAKA, OKIDONO, TAKAAKI

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PACKAGED SEMICONDUCTOR DEVICE von OKIDONO, TAKAAKI, TAKEMURA, SEIJI, KAWAI, MASATAKA, HAMADA, TOMOMI

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