High-density (4.4F/sup 2/) NAND flash technology using Super-Shallow Channel Profile (SSCP) engineering von Arai, F., Arai, N., Satoh, S., Yaegashi, T., Kamiya, E., Matsunaga, Y., Takeuchi, Y., Kamata, H., Shimizu, A., Ohtami, N., Kai, N., Takahashi, S., Moriyama, W., Kugimiya, K., Miyazaki, S., Hirose, T., Meguro, H., Hatakeyama, K., Shimizu, K., Shirota, R.

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