Reflection and durability study of different types of backsheets and their impact on c-Si PV module performance von Kim, Namsu, Lee, Seoungsoo, Zhao, Xing Guan, Kim, Dajung, Oh, Chulmin, Kang, Hanjun

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Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process von Won, Miso, Kim, Dajung, Yang, Hyunseung, Oh, Chulmin

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Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles von Hong, Won Sik, Kim, Mi Song, Oh, Chulmin, Joo, Yongjin, Kim, Youngseok, Hong, Kyoung-Kuk

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Nano-volcanic Eruption of Silver von Lin, Shih-kang, Nagao, Shijo, Yokoi, Emi, Oh, Chulmin, Zhang, Hao, Liu, Yu-chen, Lin, Shih-guei, Suganuma, Katsuaki

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Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module von Hong, Won Sik, Kim, Mi Song, Kim, Dajung, Oh, Chulmin

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Hillock growth dynamics for Ag stress migration bonding von Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere von Oh, Chulmin, Choi, Yoonhwa, Kim, Dajung, Won, Miso, Yang, Hyunseung, Hong, Wonsik

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Non-resonant lasing in a deep-hole scattering cavity von Oh, ChulMin, Ma, Ho Jin, Lee, KyeoReh, Kim, Do Kyung, Park, YongKeun

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Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations von Kim, Dajung, Park, Jiyeon, Jang, Jeongki, Yang, Hyunseung, Kim, Kwangho, Oh, Chulmin, Kim, Dongjin

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Development of solderable layer on power MOSFET for double-side bonding von Kim, Dajung, Won, Mi So, Jang, Jeongki, Kim, Sooseong, Oh, Chulmin

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Copper electrochemical migration growth in an air HAST von Oh, Sangjoo, Kim, Dajung, Hong, Wonsik, Kim, Keunsoo, Oh, Chulmin

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Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards von Hong, Won Sik, Oh, Chulmin

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Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate von Hong, Won Sik, Kim, Mi Song, Oh, Chulmin

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Silver stress migration bonding driven by thermomechanical stress with various substrates von Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

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Pressureless Bonding Using Sputtered Ag Thin Films von Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

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Nondestructive evaluation on dispersion of steel fibers in UHPC using THz electromagnetic waves von Kim, Heonyoung, Kang, Donghoon, Oh, Seung Jae, Joo, Chulmin

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Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films von Oh, Chulmin, Nagao, Shijo, Kunimune, Teppei, Suganuma, Katsuaki

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Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics von Hong, Won Sik, Oh, Chulmin, Kim, Mi-Song, Lee, Young Woo, Kim, Hui Joong, Hong, Sung Jae, Moon, Jeong Tak

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Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders von Oh, Chulmin, Kim, Ayoung, Kim, Juhee, Bang, Junghwan, Ha, Jeongwon, Hong, Won-Sik

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Pressureless Ag Thin-Film Die-Attach for SiC Devices von Sugahara, Tohru, Oh, Chulmin, Suganuma, Katsuaki, Nagao, Shijo

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