Nano-volcanic Eruption of Silver von Lin, Shih-kang, Nagao, Shijo, Yokoi, Emi, Oh, Chulmin, Zhang, Hao, Liu, Yu-chen, Lin, Shih-guei, Suganuma, Katsuaki

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Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module von Hong, Won Sik, Kim, Mi Song, Kim, Dajung, Oh, Chulmin

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Hillock growth dynamics for Ag stress migration bonding von Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere von Oh, Chulmin, Choi, Yoonhwa, Kim, Dajung, Won, Miso, Yang, Hyunseung, Hong, Wonsik

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Non-resonant lasing in a deep-hole scattering cavity von Oh, ChulMin, Ma, Ho Jin, Lee, KyeoReh, Kim, Do Kyung, Park, YongKeun

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Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations von Kim, Dajung, Park, Jiyeon, Jang, Jeongki, Yang, Hyunseung, Kim, Kwangho, Oh, Chulmin, Kim, Dongjin

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Silver stress migration bonding driven by thermomechanical stress with various substrates von Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

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Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate von Hong, Won Sik, Kim, Mi Song, Oh, Chulmin

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Pressureless Bonding Using Sputtered Ag Thin Films von Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

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Pressureless Ag Thin-Film Die-Attach for SiC Devices von Oh, Chulmin, Suganuma, Katsuaki, Nagao, Shijo, Sugahara, Tohru

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Creep lifetime prediction of solder joint for heat sink assembly von Han, Changwoon, Oh, Chulmin, Park, Nochang, Hong, Wonsik

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Creep mechanism fractography analysis on SnPb eutectic solder joint failure von Chulmin Oh, Changwoon Han, Nochang Park, Byungsuk Song, Wonsik Hong

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Bonding structure and method for producing bonding structure von Nagao, Shijo, Oh, Chulmin, Suganuma, Katsuaki

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BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE von SUGANUMA Katsuaki, NAGAO Shijo, OH Chulmin

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Dispensing device and pharmaceutical composition for treating rhinitis von BHOSALE VIKRAM M, DHUPPAD ULHAS R, KHAIRATKAR-JOSHI NEELIMA, OH CHULMIN, AGARWAL PIYUSH, WALE DINESH PRABHAKAR, KULKARNI AMIT, ANKAM RAJESH, DHATRAK CHANDRAKANT, TANTRY SUDESH K, KATYKUVO, ARKADII, GUPTA YOGESH, KEOHANE PATRICK

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BONDED STRUCTURE AND METHOD FOR PRODUCING BONDED STRUCTURE von OH CHULMIN, SUGANUMA KATSUAKI, NAGAO SHIJO

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BONDED STRUCTURE AND METHOD FOR PRODUCING BONDED STRUCTURE von OH CHULMIN, SUGANUMA KATSUAKI, NAGAO SHIJO

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A skin-integrated transparent and stretchable strain sensor with interactive color-changing electrochromic displays von Park, Heun, Kim, Dong Sik, Hong, Soo Yeong, Kim, Chulmin, Yun, Jun Yeong, Oh, Seung Yun, Jin, Sang Woo, Jeong, Yu Ra, Kim, Gyu Tae, Ha, Jeong Sook

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Terahertz reflectometry imaging for low and high grade gliomas von Ji, Young Bin, Oh, Seung Jae, Kang, Seok-Gu, Heo, Jung, Kim, Sang-Hoon, Choi, Yuna, Song, Seungri, Son, Hye Young, Kim, Se Hoon, Lee, Ji Hyun, Haam, Seung Joo, Huh, Yong Min, Chang, Jong Hee, Joo, Chulmin, Suh, Jin-Suck

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Predicting Immunogenic Epitopes Variation of Envelope 2 Gene Among Chikungunya Virus Clonal Lineages by an In Silico Approach von Cho, Sung-Yeon, Lee, Dong-Gun, Park, Jung Yeon, Kim, Won-Bok, Lee, Raeseok, Nho, Dukhee, Oh, Eun-Jee, Lee, Hyeyoung, Park, Chulmin

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