Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints von Zhang, Lingyun, Ou, Shengquan, Huang, Joanne, Tu, K. N., Gee, Stephen, Nguyen, Luu

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Electromigration and critical product in eutectic SnPb solder lines at 100 ° C von Agarwal, R., Ou, Shengquan E., Tu, K. N.

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Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester von Xu, Yuhuan, Ou, Shengquan, Tu, K.N., Zeng, Kejun, Dunne, Rajiv

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Nano-crystallization and magnetic properties in the highly resistive Fe–Si–Zr–O films prepared by EB-PVD von Bi, Xiaofang, Ou, Shengquan, Gong, Shengkai, Xu, Huibin

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Optical fiber packaging by lead (Pb)-free solder in V-grooves von Ou, Shengquan, Xu, Gu, Xu, Yuhuan, Tu, K.N.

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Magnetic and electrical properties of FeSi/FeSi-ZrO2 multilayers prepared by EB-PVD von Bi, Xiaofang, Lan, Weihua, Ou, Shengquan, Gong, Shengkai, Xu, Huibin

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The application of lead-free solder to optical fiber packaging von SHENGQUAN OU, XU, G. U, YUHUAN XU, TU, K. N

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Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad von Shengquan Ou, Yuhuan Xu, Tu, K.N., Alam, M.O., Chan, Y.C.

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A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines von Shengquan Ou, Tu, K.N.

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The application of lead-free solder to optical fiber packaging shengquan von Ou, Shengquan, Xu, Gu, Xu, Yuhuan, Tu, K N

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Magnetic and electrical properties of FeSi/FeSi–ZrO 2 multilayers prepared by EB-PVD von Bi, Xiaofang, Lan, Weihua, Ou, Shengquan, Gong, Shengkai, Xu, Huibin

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Multi-chip packaging von De Bonis, Thomas J, Spencer, Todd, Wang, Guotao, Sun, Yang, Sankman, Robert L, Ou, Shengquan, Agraharam, Sairam

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Multi-chip packaging von De Bonis, Thomas J, Spencer, Todd, Wang, Guotao, Sun, Yang, Sankman, Robert L, Ou, Shengquan, Agraharam, Sairam

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MULTI-CHIP PACKAGING von De Bonis, Thomas J, Spencer, Todd, Wang, Guotao, Sun, Yang, Sankman, Robert L, Ou, Shengquan, Agraharam, Sairam

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Multi-chip packaging von De Bonis, Thomas J, Spencer, Todd, Wang, Guotao, Sun, Yang, Sankman, Robert L, Ou, Shengquan, Agraharam, Sairam

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MULTI-CHIP PACKAGING von De Bonis, Thomas J, Spencer, Todd, Wang, Guotao, Sun, Yang, Sankman, Robert L, Ou, Shengquan, Agraharam, Sairam

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Structures to mitigate contamination on a back side of a semiconductor substrate von Shi Hualiang, Ou Shengquan E, Brun Xavier F, Wu Hao, Mamodia Mohit, Agrawal Shweta

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MULTI-CHIP PACKAGING von OU, Shengquan, SUN, Yang, DE BONIS, Thomas, AGRGHARAM, Sairam, SPENCER, Todd, WANG, Guotao, SANKMAN, Robert

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MULTI-CHIP PACKAGING von OU, Shengquan, SUN, Yang, DE BONIS, Thomas, AGRGHARAM, Sairam, SPENCER, Todd, WANG, Guotao, SANKMAN, Robert

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MULTI-CHIP PACKAGING von OU, Shengquan, SUN, Yang, AGRAHARAM, Sairam, DE BONIS, Thomas, SPENCER, Todd, WANG, Guotao, SANKMAN, Robert

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