Observations of IMC Formation for Au Wire Bonds to Al Pads von DeLucca, John, Osenbach, John, Baiocchi, Frank

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Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints von Coyle, R., Osenbach, J., Collins, M. N., McCormick, H., Read, P., Fleming, D., Popowich, R., Punch, J., Reid, M., Kummerl, S.

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Creep and its effect on Sn whisker growth von Osenbach, John W.

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System-on-Chip Photonic Integrated Circuits von Kish, Fred, Lal, Vikrant, Evans, Peter, Corzine, Scott W., Ziari, Mehrdad, Butrie, Tim, Reffle, Mike, Tsai, Huan-Shang, Dentai, Andrew, Pleumeekers, Jacco, Missey, Mark, Fisher, Matt, Murthy, Sanjeev, Salvatore, Randal, Samra, Parmijit, Demars, Scott, Kim, Naksup, James, Adam, Hosseini, Amir, Studenkov, Pavel, Lauermann, Matthias, Going, Ryan, Mingzhi Lu, Jiaming Zhang, Jie Tang, Bostak, Jeff, Vallaitis, Thomas, Kuntz, Matthias, Pavinski, Don, Karanicolas, Andrew, Behnia, Babak, Engel, Darrell, Khayam, Omer, Modi, Nikhil, Chitgarha, Mohammad Reza, Mertz, Pierre, Ko, Wilson, Maher, Robert, Osenbach, John, Rahn, Jeffrey T., Han Sun, Kuang-Tsan Wu, Mitchell, Matthew, Welch, David

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Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory von Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A.N., Hooghan, K.N., Suratkar, P., Ruengsinsub, P.

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Demonstration of a 2 × 800 Gb/s/wave Coherent Optical Engine Based on an InP Monolithic PIC von Porto, Stefano, Chitgarha, Mohammad, Leung, Irene, Maher, Robert, Going, Ryan, Wolf, Stefan, Studenkov, Pavel, Zhang, Jiaming, Hodaei, Hossein, Frost, Thomas, Tsai, Huan-Shang, Buggaveeti, Sanketh, Rashidinejad, Amir, Yekani, Amin, Mirzaei Nejad, Reza, Iglesias Olmedo, Miguel, Kerns, Samantha, Diniz, Julio, Pavinski, Donald, Brigham, Robert, Foo, Ben, Al-Khateeb, Mohammad, Koenig, Swen, Samra, Parmijit, Missey, Mark, Dominic, Vincent, Sun, Han, Sanders, Steve, Osenbach, John, Corzine, Scott, Evans, Peter, Lal, Vikrant, Ziari, Mehrdad

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800G DSP ASIC Design Using Probabilistic Shaping and Digital Sub-Carrier Multiplexing von Sun, Han, Torbatian, Mehdi, Karimi, Mehdi, Maher, Robert, Thomson, Sandy, Tehrani, Mohsen, Gao, Yuliang, Kumpera, Ales, Soliman, George, Kakkar, Aditya, Osman, Mohammad, El-Sahn, Ziad A., Doggart, Clayton, Hou, Weikun, Sutarwala, Shailesh, Wu, Yuejian, Chitgarha, Mohammad Reza, Lal, Vikrant, Tsai, Huan-Shang, Corzine, Scott, Zhang, Jiaming, Osenbach, John, Buggaveeti, Sanketh, Morbi, Zulfikar, Olmedo, Miguel Iglesias, Leung, Irene, Xu, Xian, Samra, Parmijit, Dominic, Vince, Sanders, Steve, Ziari, Mehrdad, Napoli, Antonio, Spinnler, Bernhard, Wu, Kuang-Tsan, Kandappan, Parthiban

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1.00 (0.88) Tb/s per Wave Capable Coherent Multi-Channel Transmitter (Receiver) InP-Based PICs With Hybrid Integrated SiGe Electronics von Going, Ryan W., Lauermann, Matthias, Maher, Robert, Huan-Shang Tsai, Hosseini, Amir, Mingzhi Lu, Naksup Kim, Studenkov, Pavel, Corzine, Scott W., Summers, Joseph, Anagnosti, Maria, Montazeri, Mohammad, Jiaming Zhang, Behnia, Babak, Jie Tang, Buggaveeti, Sanketh, Vallaitis, Thomas, Osenbach, John, Kuntz, Matthias, Xian Xu, Croussore, Kevin, Lal, Vikrant, Evans, Peter, Rahn, Jeffrey T., Butrie, Tim, Karanicolas, Andrew, Kuang-Tsan Wu, Mitchell, Matthew, Ziari, Mehrdad, Welch, David, Kish, Fred

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Corrosion-induced degradation of microelectronic devices von Osenbach, John W

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Tin Whisker Test Development-Temperature and Humidity Effects Part II: Acceleration Model Development von Osenbach, J.W., Reynolds, H.L., Henshall, G., Parker, R.D., Peng Su

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ENIG Corrosion Induced by Second-Phase Precipitation von Osenbach, John, Amin, Ahmed, Baiocchi, Frank, DeLucca, John

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HYBRID INTEGRATED CIRCUIT PACKAGE von Osenbach, John W, Zhang, Jiaming

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BALL GRID ARRAY RF PACKAGE CONFIGURATIONS von Osenbach, John W, Zhang, Jiaming, Gregorich, Thomas, Li, Li

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THERMAL INTERFACE MATERIAL CONTAINMENT von Reichert, Gannon, Osenbach, John W, Nguyen, Vinh

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FAN OUT INTEGRATED CIRCUIT DEVICE PACKAGES ON LARGE PANELS von OSENBACH JOHN

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PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCUITRY DEVICE von Osenbach, John W, Reffle, Michael, Butrie, Timothy, Kish, Fred A

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Low-cost 3D face-to-face out assembly von OSENBACH JOHN

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Tin Whisker Test DevelopmentaTemperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection von Reynolds, Heidi L, Osenbach, John W, Henshall, Gregory, Parker, Richard D, Su, Peng

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Tin Whisker Test DevelopmentaTemperature and Humidity Effects Part II: Acceleration Model Development von Osenbach, John W, Reynolds, Heidi L, Henshall, Gregory, Parker, Richard Dixon, Su, Peng

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HEAT SPREADER FOR ATTACHING TO A SUBSTRATE IN AN ELECTRONIC DEVICE FORMING A STACKED INTERCONNECT HEAT SINK von Bachman, Mark A, Osenbach, John W, Merchant, Sailesh M

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