Fabrication of the TiC/6061 Aluminum Alloy Composite by the Combination Process of Combustion Reaction and Vortex Technique von Omura, Naoki, Kobashi, Makoto, Kanetake, Naoyuki

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Fabrication of the TiC/Al Composite by the Combination Process of Combustion Reaction and Vortex Technique von Omura, Naoki, Kobashi, Makoto, Kanetake, Naoyuki

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Brachial plexus injury and upper rib fracture after median sternotomy in cardiac surgery von Okabayashi, Ryo, Suzuki, Shigeya, Omura, Takao, Tsuda, Kazumasa, Ishigami, Naoyuki, Suzuki, Kazuchika, Akuzawa, Satoshi, Kando, Yumi, Arima, Daisuke, Matsuyama, Yukihiro

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Synthesis of TiC/Aluminum Composite by Reactive Infiltration Process von Kobashi, Makoto, Choh, Takao, Kanetake, Naoyuki, Omura, Naoki

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Filling plating system and filling plating method von Omura, Naoyuki, Okamachi, Takuya, Matsuda, Kanako

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Fast Calculation of Full Color Image Hologram Using Distance Look-Up Table von Kitayama, Ryota, Omura, Naoyuki, Yamaguchi, Takeshi, Yoshikawa, Hiroshi

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Synthesis of TiC Particle Reinforced Aluminum Composite by Reactive Infiltration Process von Omura, Naoki, Kobashi, Makoto, Choh, Takao, Kanetake, Naoyuki

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Utilization of ADMICS on the Workstation of Total Ordering System in Shimane Medical University Hospital von KATAGIRI, YOSHIHIRO, NISHIMURA, HISAO, OMURA, NAOYUKI, IWAMOTO, KIKUO

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EFFECTS OF A NOVEL IMMUNOSUPPRESSANT, FTY720, ON HEART AND LIVER TRANSPLANTATIONS IN RATS von Yamashita, Kenichiro, Nomura, Masaru, Takehara, Megumi, Omura, Takashi, Yanagida, Naoyuki, Suzuki, Tomomi, Shimamura, Tsuyoshi, Kishida, Akihiro, Furukawa, Hiroyuki, Todo, Satoru

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Copper electrolytic plating bath and copper electrolytic plating film von Itakura, Yuki, Omura, Naoyuki, Ikumoto, Raihei, Kato, Kazunari

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FILLING PLATING SYSTEM AND FILLING PLATING METHOD von Omura, Naoyuki, Okamachi, Takuya, Matsuda, Kanako

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TWI760418B von OKAMACHI, TAKUYA, OMURA, NAOYUKI, MATSUDA, KANAKO

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PORTABLE TERMINAL, CHARACTER INPUT METHOD, AND CHARACTER INPUT PROGRAM von TOJO JUN, OMURA NAOYUKI, YAMAGUCHI JUNYA

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COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING FILM von ITAKURA, Yuki, KATO, Kazunari, IKUMOTO, Raihei, OMURA, Naoyuki

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Envelope Printing System by Using the Data of Prescription Ordering von KATAGIRI, YOSHIHIRO, NISHIMURA, HISAO, OMURA, NAOYUKI, IWAMOTO, KIKUO

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Recent Revision of Package Inserts von KATAGIRI, YOSHIHIRO, OMURA, NAOYUKI, NISHIMURA, HISAO, IWAMOTO, KIKUO

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COPPER-ELECTROPLATING BATH AND COPPER-ELECTROPLATING METHOD von ISONO TOSHIHISA, OMURA NAOYUKI

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Plating method von Isono Toshihisa, Omura Naoyuki, Tachibana Shinji, Matsuda Kanako

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TWI754729B von ITAKURA, YUKI, IKUMOTO, RAIHEI, OMURA, NAOYUKI, KATO, KAZUNARI

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Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath von SHIMIZU KOJI, ISONO TOSHIHISA, TACHIBANA SHINJI, OMURA NAOYUKI

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