Numerical Analysis of Aerodynamic Characteristics of Hyperloop System von Oh, Jae-Sung, Kang, Taehak, Ham, Seokgyun, Lee, Kwan-Sup, Jang, Yong-Jun, Ryou, Hong-Sun, Ryu, Jaiyoung

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Fault Diagnosis of Planetary Gear Carrier Packs: A Class Imbalance and Multiclass Classification Problem von Han, Soonyoung, Choi, Hae-Jin, Choi, Seung-Kyum, Oh, Jae-Sung

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High-Efficiency Bidirectional LLC Resonant Converter with Primary Auxiliary Windings von Kim, Eun-Soo, Oh, Jae-Sung

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Inductive Design Exploration Method with Active Learning for Complex Design Problems von Jang, Sungwoo, Choi, Hae-Jin, Choi, Seung-Kyum, Oh, Jae-Sung

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High temperature oxidation behavior of Ni-Cr-Al based powder porous metal von Oh, Jae-Sung, Shim, Min-Chul, Park, Man-Ho, Lee, Kee-Ahn

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High Temperature Oxidation of Ni-Fe-Cr-Al Porous Metal von Choi, Sung-Hwan, Oh, Jae-Sung, Yun, Jung-Yeul, Kong, Young-Min, Kim, Byoung-Kee, Lee, Kee-Ahn

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Manufacturing And High Temperature Oxidation Properties Of Electro-Sprayed Fe-24.5% Cr-5%Al Powder Porous Metal von Lee, Kee-Ahn, Oh, Jae-Sung, Kong, Young-Min, Kim, Byoung-Kee

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The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering von Lee, Jeong Hwan, Ma, Sung Woo, Kim, Young Min, Lee, Jin Su, Kim, Ki Bum, Kim, Jae Myun, Oh, Jae Sung, Kim, Namseog, Kim, Young-Ho

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Effect of Pre-Oxidation on the High Temperature Oxidation Behavior of Fe-Cr-Al Powder Porous Metal von Lim, Seon Hui, Choi, Sung Hwan, Lee, Kee Ahn, Park, Man Ho, Oh, Jae Sung

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Reliability studies on micro-bumps for 3-D TSV integration von Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim

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Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction von Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Chia, Pierre, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.

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Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration von Young-Bae Park, Seung-Hyun Kim, Jong-Jin Park, Kim, June-Bum, Ho-Young Son, Kwon-Whan Han, Jae-Sung Oh, Nam-Seog Kim, Sehoon Yoo

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Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages von Ho-Young Son, Woong-Sun Lee, Seung-Kwon Noh, Min-Suk Suh, Jae-Sung Oh, Nam-Seog Kim

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Determination of creep constitutive model for 28-48WCo alloy based on experimental creep tests at 817–982 °C von Dao, Van Hung, Yoon, Kee Bong, Yang, Gimo, Oh, Jae Sung

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The Effect of Annealing Heat Treatment on the Microstructure and Macroscopic Properties of Kinetic-Sprayed Ta Coating Layer von Lee, Kee Ahn, Lee, Myeong Ju, Oh, Jae Sung, Kim, Hyung Jun, Oh, Ik Hyun

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SEMICONDUCTOR DEVICES AND RELATED METHODS von Oh, Sung Jae

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Nutritional risk index as a predictor of postoperative wound complications after gastrectomy von Oh, Cheong Ah, Kim, Dae Hoon, Oh, Seung Jong, Choi, Min Gew, Noh, Jae Hyung, Sohn, Tae Sung, Bae, Jae Moon, Kim, Sung

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Semiconductor devices and related methods von Oh, Sung Jae

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SEMICONDUCTOR DEVICES AND RELATED METHODS von Oh, Sung Jae

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A Study on Exercise Performance and Its Relating Factors in Middle-aged Women von Oh, Sung Jae, Kim, Jeung Im, Chae, Young Ran

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