Treffer 1 - 20 von 87 für Suche 'O'DAY MICHAEL P', Suchdauer: 0,83s Treffer weiter einschränken
  1. 1
    Fracture in confined thin films: A discrete dislocation study

    Fracture in confined thin films: A discrete dislocation study von Chng, Audrey C., O’Day, Michael P., Curtin, William A., Tay, Andrew A.O., Lim, Kian Meng

    Veröffentlicht in Acta materialia

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  2. 2
    Failure of Crossply Ceramic-Matrix Composites

    Failure of Crossply Ceramic-Matrix Composites von O'Day, Michael P., Curtin, William A.


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  3. 3
    TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER

    TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER von PELTO, Christopher M, JAVVAJI, Vishal, RAORANE, Digvijay A, O'DAY, Michael P, CHOI, Seung-June, ANTARTIS, Dimitrios

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  4. 4
    TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER

    TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER von PELTO, Christopher M, RAORANE, Digvijay, JAVVAJI, Vishal, O'DAY, Michael P, CHOI, Seung-June, ANTARTIS, Dimitrios

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  5. 5
    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von BHINGARDE, Siddharth B, JEZEWSKI, Christopher J, O'DAY, Michael P, KOBRINSKY, Mauro J, PANTUSO, Daniel

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  6. 6
    Optical fiber cables having multiple subunit cables

    Optical fiber cables having multiple subunit cables von REGISTER, III JAMES ARTHUR, O'DAY MICHAEL P

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  7. 7
    Techniques for enhancing fracture resistance of interconnects

    Techniques for enhancing fracture resistance of interconnects von Christopher J Jezewski, Mauro J Kobrinsky, Siddharth B Bhingarde, Daniel Pantuso, Michael P O'Day

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  8. 8
    Techniques for enhancing fracture resistance of interconnects

    Techniques for enhancing fracture resistance of interconnects von Jezewski Christopher J, Kobrinsky Mauro J, Bhingarde Siddharth B, O'Day Michael P, Pantuso Daniel

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  9. 9
    OPTICAL FIBER CABLES HAVING MULTIPLE SUBUNIT CABLES

    OPTICAL FIBER CABLES HAVING MULTIPLE SUBUNIT CABLES von REGISTER III JAMES ARTHUR, O'DAY MICHAEL P

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  10. 10
    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J

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  11. 11
    Techniques for enhancing fracture resistance of interconnects

    Techniques for enhancing fracture resistance of interconnects von BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J

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  12. 12
    OPTICAL FIBER CABLES HAVING MULTIPLE SUBUNIT CABLES

    OPTICAL FIBER CABLES HAVING MULTIPLE SUBUNIT CABLES von O'DAY, MICHAEL P, REGISTER, III, JAMES A

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  13. 13
    Techniques for enhancing fracture resistance of interconnects

    Techniques for enhancing fracture resistance of interconnects von MICHAEL P O'DAY, MAURO J KOBRINSKY, SIDDHARTH B BHINGARDE, DANIEL PANTUSO, CHRISTOPHER J JEZEWSKI

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  14. 14
    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J

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  15. 15
    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von KOBRINSKY, MAURO J, BHINGARDE, SIDDHARTH B, PANTUSO, DANIEL, JEZEWSKI, CHRISTOPHER J, O'DAY, MICHAEL P

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  16. 16
    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J

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  17. 17
    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device

    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device von KOBRINSKY, MAURO J, BHINGARDE, SIDDHARTH B, PANTUSO, DANIEL, JEZEWSKI, CHRISTOPHER J, O'DAY, MICHAEL P

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  18. 18
    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device

    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device von KOBRINSKY, MAURO J, BHINGARDE, SIDDHARTH B, PANTUSO, DANIEL, JEZEWSKI, CHRISTOPHER J, O'DAY, MICHAEL P

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  19. 19
    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device

    Integrated circuit, wire-bonded package, flip-chip package, and mobile computing device von KOBRINSKY, MAURO J, BHINGARDE, SIDDHARTH B, PANTUSO, DANIEL, JEZEWSKI, CHRISTOPHER J, O'DAY, MICHAEL P

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  20. 20
    INTEGRATED CIRCUIT WIRE-BONDED PACKAGE FLIP-CHIP PACKAGE AND MOBILE COMPUTING DEVICE FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

    INTEGRATED CIRCUIT WIRE-BONDED PACKAGE FLIP-CHIP PACKAGE AND MOBILE COMPUTING DEVICE FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS von BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J

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