Structure and orientation of films prepared by reactive sputtering of Ni, Fe, and NiFe in Ar/N2 mixtures von TAKAMORI, T, SHIH, K. K, DOVE, D. B, NYWENING, R. W, RE, M. E

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Structure and orientation of films prepared by reactive sputtering of Ni, Fe, and NiFe in Ar/N sub(2) mixtures von Takamori, T, Shih, K K, Dove, D B, Nywening, R W, Re, M E

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A six-mask TFT-LCD process using copper-gate metallurgy von Fryer, P. M., Colgan, E., Galligan, E., Graham, W., Horton, R., Hunt, D., Jenkins, L., John, R., Koke, P., Kuo, Y., Latzko, K., Libsch, F., Lien, A., Nywening, R., Polastre, R., Rothwell, M. E., Wilson, J., Wisnieff, R., Wright, S.

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Iron/iron nitride multilayer films von RE, MARK E, SHIH, KWANG K, NYWENING, ROBERT W, DOVE, DEREK B

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