Compression force–depth relationship during out-of-hospital cardiopulmonary resuscitation von Tomlinson, A.E, Nysaether, J, Kramer-Johansen, J, Steen, P.A, Dorph, E

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Incomplete chest recoil during piglet CPR worsens hemodynamics von Zuercher, M, Hilwig, R.W, Nysaether, J, Nadkarni, V.M, Berg, M.D, Ewy, G.A, Kern, K.B, Berg, R.A

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Novel methods to determine pediatric anterior-posterior thoracic force-deflection characteristics von Maltese, M.R., Arbogast, K.B., Nadkarni, V., Winkelstein, B., Miklebust, H., Nysaether, J.

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A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing von Vermesan, O., Riisnaes, K.H., Le Pailleur, L., Nysaether, J.B., Bauge, M., Rustad, H., Clausen, S., Blystad, L.-C., Grindvoll, H., Pedersen, R., Pezzani, R., Kaire, D.

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Capacitive differential pressure sensor for harsh environments von Moe, S.T, Schjølberg-Henriksen, K, Wang, D.T, Lund, E, Nysæther, J, Furuberg, L, Visser, M, Fallet, T, Bernstein, R.W

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Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors von ther, J B Nysæ, Larsen, A, Liverød, B, Ohlckers, P

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Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors von Nysæther, J.B., Larsen, A., Liverød, B., Ohlckers, P.

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Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints von Nysaether, J.B., Lai, Z., Liu, J.

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Examining the potential of using thorax impedance measured by automated external defibrillators for quantification of circulation von Risdal, M., Losert, H., Nysaether, J., Eftestol, T., Sterz, F., Aase, S.O.

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A capacitive hybrid flip-chip ASIC and sensor for fingerprint, navigation and pointer detection von Vermesan, O., Riisnaes, K.H., Le-Pailleur, L., Nysaether, J.B., Bauge, M., Rustad, H., Clausen, S., Blystad, L.-C., Grindvoll, H., Pedersen, R., Pezzani, R., Kaire, D.

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Measurements of solder bump lifetime as a function of underfill material properties von Nysaether, J.B., Lundstrom, P., Liu, J.

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Isotropically conductive adhesives and solder bumps for flip chip on board circuits-a comparison of lifetime under thermal cycling von Nysaether, J.B., Lai, Z., Liu, J.

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Energy assessments of onboard CO2 capture from ship engines by MEA-based post combustion capture system with flue gas heat integration von Einbu, A., Pettersen, T., Morud, J., Tobiesen, A., Jayarathna, C.K., Skagestad, R., Nysæther, G.

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Measurements of solder bump lifetime as a function of underfill material properties von Nysaether, J.B., Lundstrom, P., Liu, J.

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Worldwide implementation of the WHO Child Growth Standards von de Onis, Mercedes, Onyango, Adelheid, Borghi, Elaine, Siyam, Amani, Blössner, Monika, Lutter, Chessa

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Enrolment and baseline characteristics in the WHO Multicentre Growth Reference Study von WHO Multicentre Growth Reference Study Group

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Live finger detection by four-point measurement of complex impedance von MARTINSEN ORJAN G.,NYSAETHER JON,RISSNAES KNUT,DYVE INGVILD J.,MOSTAD GEIR,PEDERSEN RUNE,CHRISTIE NICOLAI W.,CLAUSEN SIGMUND

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Ordovician palaeogeography with new palaeomagnetic data from the Montagne Noire (Southern France) von Nysæther, E., Torsvik, T.H., Feist, R., Walderhaug, H.J., Eide, E.A.

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Development of intraformational (Oligocene–Miocene) faults in the northern North Sea: influence of remote stresses and doming of Fennoscandia von Clausen, J.A, Gabrielsen, R.H, Reksnes, P.A, Nysæther, E

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Live finger detection by four-point measurement of complex impedance von PEDERSEN RUNE, CLAUSEN SIGMUND, MARTINSEN ORJAN G, CHRISTIE NICOLAI W, NYSAETHER JON, DYVE INGVILD J, RISSNAES KNUT, MOSTAD GEIR

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