Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability von Nxumalo, Jochonia N, Safran, John M, Liu, Joyce C, Rosenblatt, Sami, Kothandaraman, Chandrasekharan

Volltext bestellen

THROUGH-SILICON VIA WITH IMPROVED SUBSTRATE CONTACT FOR REDUCED THROUGH-SILICON VIA (TSV) CAPACITANCE VARIABILITY von LIU, Joyce C, ROSENBLATT, Sami, NXUMALO, Jochonia N, KOTHANDARAMAN, Chandrasekharan, SAFRAN, John M

Volltext bestellen

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability von Nxumalo Jochonia N, Rosenblatt Sami, Kothandaraman Chandrasekharan, Safran John M, Liu Joyce C

Volltext bestellen

Apparatus and method for atomic force probing/SEM nano-probing/scanning probe microscopy and collimated ion milling von Nxumalo Jochonia N, Stanton Matthew F, Kane Terence L, Marsin Robert P

Volltext bestellen

Through-silicon via with improved substrate contact for reduced through-silicon via (tsv) capacitance variability von ROSENBLATT, SAMI, LIU JOYCE C, SAFRAN, JOHN M, NXUMALO, JOCHONIA N, KOTHANDARAMAN, CHANDRASEKHARAN

Volltext bestellen

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability von ROSENBLATT, SAMI, SAFRAN, JOHN M, LIU, JOYCE C, NXUMALO, JOCHONIA N, KOTHANDARAMAN, CHANDRASEKHARAN

Volltext bestellen

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability von JOHN M. SAFRAN, JOCHONIA N. NXUMALO, JOYCE C. LIU, CHANDRASEKHARAN KOTHANDARAMAN, SAMI ROSENBLATT

Volltext bestellen