A new metal-organic chemical vapor deposition process for selective copper metallization von Norman, J.A.T., Muratore, B.A., Dyer, P.N., Roberts, D.A., Hochberg, A.K., Dubois, L.H.

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Enhanced chemical vapor deposition of copper from (hfac)Cu(TMVS) using liquid coinjection of TMVS von PETERSEN, G. A, PARMETER, J. E, APBLETT, C. A, GONZALES, M. F, SMITH, P. M, OMSTEAD, T. R, NORMAN, J. A. T

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Method for producing metal-ligand compositions von D.A. ROBERTS, SENZAKI YOSHIHIDE, J.A.T. NORMAN

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New OMCVD precursors for selective copper metallization von Norman, J.A.T., Muratore, B.A., Dyer, P.N., Roberts, D.A., Hochberg, A.K.

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