Thermal cycling reliability of lead-free chip resistor solder joints von Suhling, Jeffrey C, Gale, H.S, Wayne Johnson, R, Nokibul Islam, M, Shete, Tushar, Lall, Pradeep, Bozack, Michael J, Evans, John L, Seto, Ping, Gupta, Tarun, Thompson, James R

Volltext

Thermal cycling reliability of leadfree chip resistor solder joints von Suhling, Jeffrey C., Gale, H.S., Wayne Johnson, R., Nokibul Islam, M., Shete, Tushar, Lall, Pradeep, Bozack, Michael J., Evans, John L., Seto, Ping, Gupta, Tarun, Thompson, James R.

Volltext

Thermal cycling reliability of lead free solders for automotive applications von Suhling, J.C., Gale, H.S., Johnson, R.W., Islam, M.N., Shete, T., Lall, P., Bozack, M.J., Evans, J.L., Ping Seto, Gupta, T., Thompson, J.R.

Volltext bestellen

Prognostics and Health Management of Electronic Packaging von Lall, P., Islam, M.N., Rahim, M.K., Suhling, J.C.

Volltext

Model for BGA and CSP reliability in automotive underhood applications von Lall, P., Islam, M.N., Singh, N., Suhling, J.C., Darveaux, R.

Volltext

Damage mechanics of electronics on metal-backed substrates in harsh environments von Lall, P., Islam, M.N., Evans, J., Suhling, J.C., Shete, T.

Volltext

Corner bonding of CSPs: processing and reliability von Guoyun Tian, Yueli Liu, Johnson, R.W., Lall, P., Palmer, M., Islam, M.N., Crane, L.

Volltext

Mixed Pitch BGA (mpBGA) packaging development for high bandwidth-high speed networking devices von Savic, J., Nagar, M., Weidong Xie, Ahmad, M., Senk, D., Bansal, A., Islam, N., Park Gun Oh, Pendse, R., Choi HangChul, Lee SangHo

Volltext

TIM degradation in flip chip packages von Islam, N., Seo Won Lee, Jimarez, M., Joon Yeob Lee, Galloway, J.

Volltext

Prognostics and health management of electronics von Lall, P., Hande, M., Bhat, C., Suhling, J., Islam, N.

Volltext