ONYCHOMATRICOMA, A RARE NAIL TUMOR von Tahir, M, Phung, T, Nguyen Luu, T

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Rare Case of Cutaneous Rosai Dorfman Disease Involving the Nail von Tahir, M, Phung, T, Nguyen Luu, T, Nguyen, H T

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Foreword Special Section on Drop Testing von Nguyen, Luu T.

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Thermally efficient integrated circuit package von PODDAR ANINDYA, NGUYEN LUU T

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THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE von PODDAR ANINDYA, NGUYEN LUU T

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WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS von PHAM, KEN, NGUYEN, LUU, T

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WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS von PHAM KEN, NGUYEN LUU T

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Leadframe having die attach pad with delamination and crack-arresting features von GUMASTE VIJAYLAXMI, NGUYEN LUU T

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ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY von GUMASTE VIJAYLAXMI, NGUYEN LUU T

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I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES von NGUYEN HAU, PODDAR ANINDYA, NGUYEN LUU T

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Processing of polyurethane/polyester interpenetrating polymer networks by reaction injection molding. Part II: Mixing at high reynolds numbers and impingement pressures von Nguyen, Luu T., Suh, Nam P.

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Processing of polyurethane/polyester interpenetrating polymer networks by reaction injection molding (RIM). Part I: Design of a high pressure RIM system von Nguyen, Luu T., Suh, Nam P.

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Inkjet printed leadframe von PODDAR ANINDYA, WALBERG RANDALL L, NGUYEN LUU T

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MOLDED OPTICAL PACKAGE WITH FIBER COUPLING FEATURE von WALBERG, RANDALL, L, WYSOCKI, JACOB, A, PEDROTTI, KENNETH, DAHLGREN, ROBERT, WIESER, JAMES, B, NGUYEN, LUU, T

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Inkjet printed leadframes von PODDAR ANINDYA, WALBERG RANDALL L, NGUYEN LUU T

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Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds von NGUYEN, LUU T, PHAM, KEN

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INKJET PRINTED LEADFRAMES von PODDAR ANINDYA, WALBERG RANDALL L, NGUYEN LUU T

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Apparatus and method for scribing semiconductor wafers using vision recognition von KELKAR NIKHIL V, NGUYEN LUU T

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Molded optical package with fiber coupling feature von DAHLGREN ROBERT, WYSOCKI JACOB A, PEDROTTI KENNETH, WALBERG RANDALL L, NGUYEN LUU T, WIESER JAMES B

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METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS von PRABHU, ASHOK, S, LEE, SHAW, W, PODDAR, ANINDYA, NGUYEN, LUU, T

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