Detachable Optical Chiplet Connector for Co-Packaged Photonics von Psaila, Nicholas, Nekkanty, Srikant, Shia, David, Tadayon, Pooya

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Liquid Metal Interconnects for High Pin Count Scaling and Socketing Applications von Nekkanty, Srikant, Meyyappan, Karumbu, Mondal, Saikat, Tadayon, Pooya

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Gallium‐Based Liquid‐Metal Alloys: Challenges and Risk Management in High‐Humidity Environments von Meyyappan, Karumbu, Arrington, Kyle, Tadayon, Pooya, Murtagian, Gregorio, Lin, Ziyin, Ouvarov‐Bancalero, Valery, Tran, Donald, Nekkanty, Srikant

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Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities von Mahajan, Ravi, Li, Xiaoqian, Fryman, Joshua, Zhang, Zhichao, Nekkanty, Srikant, Tadayon, Pooya, Jaussi, James, Shumarayev, Sergey, Agrawal, Ankur, Jadhav, Susheel, Singh, Kumar Abhishek, Alduino, Andrew, Gujjula, Sushrutha, Chiu, Chia-Pin, Nordstog, Thomas, Hosseini, Kaveh J., Sane, Sandeep, Deshpande, Nitin, Aygun, Kemal, Sarkar, Arnab, Dobriyal, Priyanka, Pothukuchi, Suresh, Pogue, Vanessa, Hui, David

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Liquid Metal based Low Resistance Interconnect Technology von Meyyappan, Karumbu, Tadayon, Pooya, Murtagian, Gregorio, Nekkanty, Srikant, Ouvarov-Bancalero, Valery, Lin, Ziyin, Lu, Xiao

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Digital tomosynthesis (DTS) for quantitative assessment of trabecular microstructure in human vertebral bone von Kim, Woong, Oravec, Daniel, Nekkanty, Srikant, Yerramshetty, Janardhan, Sander, Edward A, Divine, George W, Flynn, Michael J, Yeni, Yener N

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Optimizing Thin Film Tool Coatings Using a Finite Element Computer Simulator von Draguljić, Danel, Nekkanty, Srikant, Santner, Thomas, Dean, Angela, Shivpuri, Rajiv

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Stiffness of the endplate boundary layer and endplate surface topography are associated with brittleness of human whole vertebral bodies von Nekkanty, Srikant, Yerramshetty, Janardhan, Kim, Do-Gyoon, Zauel, Roger, Johnson, Evan, Cody, Dianna D, Yeni, Yener N

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ACTIVE OPTICAL COUPLER von PRATAP, Divya, NEKKANTY, Srikant

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ACTIVE OPTICAL COUPLER von PRATAP, Divya, NEKKANTY, Srikant

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A cohesive zone finite element approach to model tensile cracks in thin film coatings von Nekkanty, Srikant, Walter, Mark, Shivpuri, Rajiv

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TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS von Nekkanty, Srikant, Tran, Donald Tiendung

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Dual-sided socket device with corrugation structures von Mohammad, Feroz, Nekkanty, Srikant, Klein, Steven

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Indentation damage to boron carbide–DLC coatings with different compositions von Nekkanty, Srikant, Walter, Mark E.

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SOCKETS HAVING FINE PITCH 3D FEATURES von Zhang, Zhichao, Mondal, Saikat, Tran, Donald T, Nekkanty, Srikant

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METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY von ABRAHAM, Vineeth, MORET, Eric, MORGAN, Wesley, DIGLIO, Paul, NEKKANTY, Srikant

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METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY von ABRAHAM, Vineeth, MORET, Eric, MORGAN, Wesley, DIGLIO, Paul, NEKKANTY, Srikant

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INTEGRATED EMBEDDED SUBSTRATE AND SOCKET von VISWANATH, Ram, NEKKANTY, Srikant

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Electrical connector with insulated conductive layer von Jensen, Morten, Nekkanty, Srikant, Ryan, Michael, Walczyk, Joe F

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LIQUID METAL BASED FIRST LEVEL INTERCONNECTS von Nekkanty, Srikant, Meyyappan, Karumbu Nathan, Arrington, Kyle J

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