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  1. 1
    Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors

    Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors von Namkoung, Yun Mi, Lee, Hae-Min, Son, Young-Seon, Lee, Kangtaek, Kim, Chang-Koo


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  2. 2
    Dependence of etch rates of silicon substrates on the use of C4F8 and C4F6 plasmas in the deposition step of the Bosch process

    Dependence of etch rates of silicon substrates on the use of C4F8 and C4F6 plasmas in the deposition step of the Bosch process von Rhee, Hyongmoo, Lee, Hae Min, Namkoung, Yun Mi, Kim, Chang-Koo, Chae, Heeyeop, Kim, Yil Wook


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  3. 3
    Dependence of etch rates of silicon substrates on the use of C 4 F 8 and C 4 F 6 plasmas in the deposition step of the Bosch process

    Dependence of etch rates of silicon substrates on the use of C 4 F 8 and C 4 F 6 plasmas in the deposition step of the Bosch process von Rhee, Hyongmoo, Lee, Hae Min, Namkoung, Yun Mi, Kim, Chang-Koo, Chae, Heeyeop, Kim, Yil Wook


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  4. 4
    Effect of Deposition Modes on Composition and Microstructure of Electrodeposited CoWP Film

    Effect of Deposition Modes on Composition and Microstructure of Electrodeposited CoWP Film von Jeon, Wonjin, Dulal, S.M.S.I, Yun, Hyeong Jin, Namkoung, Yun Mi, Naz, Tarannum, Shin, Chee Burm, Kim, Chang-Koo


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  5. 5
    ENHANCED PREPARATION METHOD OF PERFLUOROPOLYETHER ALCOHOL

    ENHANCED PREPARATION METHOD OF PERFLUOROPOLYETHER ALCOHOL von HA, JONG WOOK, LEE, SOO BOK, PARK, IN JOON, NAMKOUNG, YUN MI, KIM, SU HAN, LEE, KWANG WON

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