Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys von Nogita, Kazuhiro

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Ga-Based Alloys in Microelectronic Interconnects: A Review von Liu, Shiqian, Sweatman, Keith, McDonald, Stuart, Nogita, Kazuhiro

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Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries von Ye, Delai, Zeng, Guang, Nogita, Kazuhiro, Ozawa, Kiyoshi, Hankel, Marlies, Searles, Debra J., Wang, Lianzhou

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Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections von Xian, J.W., Belyakov, S.A., Ollivier, M., Nogita, K., Yasuda, H., Gourlay, C.M.

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The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints von Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki, Nogita, Kazuhiro

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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces von Mohd Salleh, M.A.A., McDonald, S.D., Yasuda, H., Sugiyama, A., Nogita, K.

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Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review von Mu, D.K., McDonald, S.D., Read, J., Huang, H., Nogita, K.

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Development of high-temperature solders: Review von Zeng, Guang, McDonald, Stuart, Nogita, Kazuhiro

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The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review von Liu, Shiqian, McDonald, Stuart, Sweatman, Keith, Nogita, Kazuhiro

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Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates von Mohd Salleh, M.A.A., McDonald, S.D., Nogita, K.

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A Qualitative Interview Study on Expanded Access Clinical Trials for Compassionate Use in Japan von Hayashi, Haruto, Nogita, Takehide, Maeda, Hideki

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The role of trace element segregation in the eutectic modification of hypoeutectic Al–Si alloys von Nogita, K., Yasuda, H., Yoshiya, M., McDonald, S.D., Uesugi, K., Takeuchi, A., Suzuki, Y.

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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates von Nogita, K., Gourlay, C. M., Nishimura, T.

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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering von Ramli, M.I.I., Mohd Salleh, M.A.A., Yasuda, H., Chaiprapa, J., Nogita, K.

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Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation von Yasuda, Hideyuki, Nogita, Kazuhiro

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Eutectic modification and microstructure development in Al–Si Alloys von Dahle, A.K., Nogita, K., McDonald, S.D., Dinnis, C., Lu, L.

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In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography von Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D., Nogita, K.

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Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes von Mu, D., Huang, H., McDonald, S.D., Read, J., Nogita, K.

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The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes von Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo, Nogita, Kazuhiro

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Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy von Tan, C. Y., Mohd Salleh, M. A. A., Saud, N., Nishimura, T., Nogita, K.

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