Electrical resistivity and Seebeck coefficient of Sr6Co5O15 von IWASAKI, Kouta, SHIMADA, Masahiko, YAMANE, Hisanori, TAKAHASHI, Junichi, KUBOTA, Shunichi, NAGASAKI, Takanori, ARITA, Yuji, YUHARA, Junji, NISHI, Yoshimasa, MATSUI, Tsuneo

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Thermoelectric properties of Rh-doped Ru2Si3 prepared by floating zone melting method von ARITA, Yuji, MITSUDA, Satoshi, NISHI, Yoshimasa, MATSUI, Tsuneo, NAGASAKI, Takanori

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Influences of Bi and Cu substitutions on the power factor of Ca3Co2O6 von Iwasaki, Kouta, Yamane, Hisanori, Takahashi, Junichi, Kubota, Shunichi, Nagasaki, Takanori, Arita, Yuji, Nishi, Yoshimasa, Matsui, Tsuneo, Shimada, Masahiko

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Isotope Effects on Thermal Conductivity of Boron Carbide von NISHI, Yoshimasa, ARITA, Yuji, MATSUI, Tsuneo, NAGASAKI, Takanori

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Isotope effects on thermal diffusivity of boron carbide von Arita, Yuji, Nishi, Yoshimasa, Amaya, Masaki, Matsui, Tsuneo

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Thermoelectric properties of URu2Si2 and U2Ru3Si5 von ARITA, Yuji, TERAO, Kenji, MITSUDA, Satoshi, NISHI, Yoshimasa, MATSUI, Tsuneo, NAGASAKI, Takanori

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MULTILAYER RESIN SUBSTRATE AND METHOD FOR PRODUCING SAME von NAGAI, Tomohiro, NISHI, Yoshimasa

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RESIN MULTILAYER SUBSTRATE von NISHI YOSHIMASA, NAGAI, TOMOHIRO

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Thermoelectric properties of UB4 from 300 to 850K von Nishi, Yoshimasa, Arita, Yuji, Matsui, Tsuneo, Iwasaki, Kouta, Nagasaki, Takanori

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Thermoelectric properties of UB 4 from 300 to 850 K von Nishi, Yoshimasa, Arita, Yuji, Matsui, Tsuneo, Iwasaki, Kouta, Nagasaki, Takanori

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Thermoelectric properties of UB4 from 300 to 850 K von NISHI, Yoshimasa, ARITA, Yuji, MATSUI, Tsuneo, IWASAKI, Kouta, NAGASAKI, Takanori

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Surface-treated copper foil, and copper-clad laminate and circuit board using same von Nishi, Yoshimasa, Tsuruta, Takahiro, Uno, Takeo, Fukutake, Sunao, Okuno, Yuko

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Black liquid-crystal polymer film and multilayer board von Iida, Kanto, Nishi, Yoshimasa, Moriya, Akira, Fukutake, Sunao

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MULTILAYER RESIN SUBSTRATE AND METHOD FOR PRODUCING SAME von NISHI Yoshimasa, NAGAI Tomohiro

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SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT BOARD USING SAME von OKUNO, Yuko, FUKUTAKE, Sunao, UNO, Takeo, NISHI, Yoshimasa, TSURUTA, Takahiro

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Influences of Bi and Cu substitutions on the power factor of Ca 3Co 2O 6 von Iwasaki, Kouta, Yamane, Hisanori, Takahashi, Junichi, Kubota, Shunichi, Nagasaki, Takanori, Arita, Yuji, Nishi, Yoshimasa, Matsui, Tsuneo, Shimada, Masahiko

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Isotope Effects on Thermal Conductivity of Boron Carbide von NISHI, Yoshimasa, ARITA, Yuji, MATSUI, Tsuneo, NAGASAKI, Takanori

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Electrical resistivity and Seebeck coefficient of Sr 6Co 5O 15 von Iwasaki, Kouta, Shimada, Masahiko, Yamane, Hisanori, Takahashi, Junichi, Kubota, Shunichi, Nagasaki, Takanori, Arita, Yuji, Yuhara, Junji, Nishi, Yoshimasa, Matsui, Tsuneo

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Surface-treated copper foil, and copper-clad laminate and printed wiring board using same von Nishi, Yoshimasa, Tsuruta, Takahiro, Uno, Takeo, Fukutake, Sunao, Okuno, Yuko

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Thermoelectric properties of Rh-doped Ru 2Si 3 prepared by floating zone melting method von Arita, Yuji, Mitsuda, Satoshi, Nishi, Yoshimasa, Matsui, Tsuneo, Nagasaki, Takanori

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