Poster 45 Functional Improvement for Heart Failure Patients after Left Ventricular Assistive Device Placement in a Free Standing Rehabilitation Hospital von Nagar, Vittal R., MD, Nickerson, Robert, MD

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Offset interposers for large-bottom packages and large-die package-on-package structures von Watts, Nicholas R, Mortensen, Russell K, Nickerson, Robert M

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Poster 103 Elevated International Normalized Ratio Associated with Infections: Case Reports von Ma, Zhangliang, MD, PhD, Ortiz Vargas, Oscar O., MD, Springer, Joe E., PhD, Nickerson, Robert, MD

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OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES von WATTS, Nicholas R, MORTENSEN, Russell K, NICKERSON, Robert M

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Offset interposers for large-bottom packages and large-die package-on-package structures von Watts, Nicholas R, Mortensen, Russell K, Nickerson, Robert M

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THROUGH MOLD INTERCONNECT DRILL FEATURE von NICKERSON, Robert M, WINTERS, Rees, MUTHUR SRINATH, Purushotham Kaushik

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OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES von WATTS, Nicholas R, MORTENSEN, Russell K, NICKERSON, Robert M

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Offset interposers for large-bottom packages and large-die package-on-package structures von Watts, Nicholas R, Mortensen, Russell K, Nickerson, Robert M

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THROUGH MOLD INTERCONNECT DRILL FEATURE von NICKERSON, Robert M, WINTERS, Rees, MUTHUR SRINATH, Purushotham Kaushik

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Through mold interconnect drill feature von Winters, Rees, Muthur Srinath, Purushotham Kaushik, Nickerson, Robert M

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OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES von Watts, Nicholas R, MORTENSEN, Russell K, Nickerson, Robert M

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LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL von MAZUR, Andrew V, MYASISHCHEV, Denis, NICKERSON, Robert M, MUTHUR SRINATH, Purushotham Kaushik, GOKHALE, Shripad

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OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES von WATTS, Nicholas R, MORTENSEN, Russell K, NICKERSON, Robert M

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Poster 27 Carotid-Cavernous Fistula After Traumatic Brain Injury: A Case Report von Erlandson, Erika E., Nickerson, Robert B.

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Package on package thermal transfer systems and methods von Karhade, Omkar, Rumer, Christopher L, Deshpande, Nitin, Nickerson, Robert M

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THROUGH MOLD INTERCONNECT DRILL FEATURE von NICKERSON, Robert M, WINTERS, Rees, MUTHUR SRINATH, Purushotham Kaushik

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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Prevalence of temporomandibular disorders in fibromyalgia and failed back syndrome patients: A blinded prospective comparison study von Balasubramaniam, Ramesh, BDSc, de Leeuw, Reny, DDS, PhD, Zhu, Hua, MS, Nickerson, Robert B., MD, Okeson, Jeffrey P., DMD, Carlson, Charles R., PhD

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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