A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process von Ng, Fei Chong, Ali, M. Yusuf Tura, Abas, Aizat, Khor, C. Y., Samsudin, Z., Abdullah, M. Z.

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Surface energetic-based analytical filling time model for flip-chip underfill process von Ng, Fei Chong, Abas, Mohamad Aizat

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Spatial analysis of underfill flow in flip-chip encapsulation von Ng, Fei Chong, Zawawi, Mohd Hafiz, Abas, Mohamad Aizat

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Filling efficiency of flip-chip underfill encapsulation process von Ng, Fei Chong, Abas, Mohamad Aizat, Abdullah, Mohd Zulkifly

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Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation von Fei Chong, Ng, Zawawi, Mohd Hafiz, Lun Hao, Tung, Abas, Mohamad Aizat, Abdullah, Mohd Zulkifly

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CUF scaling effect on contact angle and threshold pressure von Ng, Fei Chong, Abas, Mohamad Aizat, Abdullah, MZ, Ishak, MHH, Chong, Gean Yuen

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Effect of different temperature distribution on multi-stack BGA package von Tung, Lun Hao, Ng, Fei Chong, Abas, Aizat, Abdullah, M.Z, Samsudin, Zambri, Tura Ali, Mohd Yusuf

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Effect of Barrier Height on the Design of Stepped Spillway Using Smoothed Particle Hydrodynamics and Particle Image Velocimetry von Azman, Aqil, Ng, Fei Chong, Zawawi, Mohd. Hafiz, Abas, Aizat, Rozainy M. A. Z., Mohd. Remy, Abustan, Ismail, Adlan, Mohd. Nordin, Tam, Wei Loon

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Performance Evaluation of Composite Cross-Arm Structure Under Different Magnitude of Loading von Mohamad, Daud, Beddu, Salmia, Syamsir, Agusril, Zahari, Nazirul Mubin, Abu Seman, Sareh Aiman Hilmi, Razali, Muhammad Fauzinizam, Abas, Aizat, Ng, Fei Chong

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Failure analysis of various fiberglass cross-arm designs under multi-axial loading von Mohamad, Daud, Beddu, Salmia, Syamsir, Agusril, Zahari, Nazirul Mubin, Razali, Muhammad Fauzinizam, Abu Seman, Sareh Aiman Hilmi, Abas, Aizat, Ng, Fei Chong

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Fluid/structure interaction study on the variation of radial gate's gap height in dam von Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa

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Underfill Flow in Flip-Chip Encapsulation Process: A Review von Ng, Fei Chong, Abas, Mohamad Aizat

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Effect of the gap height of radial gate on the volumetric flow rate in dam von Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa

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Scaling Effect on Velocity Profiles in Capillary Underfill Flow von Ng, Fei Chong, Abas, Aizat, Abdullah, M Z, Ishak, M H H, Chong, Gean Yuen

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Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA von ABAS, AIZAT, NG, FEI CHONG, GAN, Z L, ISHAK, M H H, ABDULLAH, M Z, CHONG, GEAN YUEN

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Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV) von Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa

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Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process von Ng, Fei Chong, Abas, Aizat, Abdullah, M Z, Ishak, M H H, Chong, Gean Yuen

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Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package von Ng, Fei Chong, Abas, Mohamad Aizat

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Effect of Dispensing Type on Void Formation Using Convolutional Neural Network von Azahari, Muhammad Taufik, Ling, Calvin, Abas, Aizat, Ng, Fei Chong

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Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches von Ng, Fei Chong, Abas, Aizat, Abdullah, M.Z.

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