Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation von Li, Guoyi, Lee, Hyunseong, Chattopadhyay, Aditi, Kumar Neerukatti, Rajesh, Liu, Kuang C.

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Buckypaper embedded self-sensing composite for real-time fatigue damage diagnosis and prognosis von Datta, Siddhant, Neerukatti, Rajesh Kumar, Chattopadhyay, Aditi

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A novel probabilistic approach for damage localization and prognosis including temperature compensation von Neerukatti, Rajesh Kumar, Hensberry, Kevin, Kovvali, Narayan, Chattopadhyay, Aditi

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Ultrasonic guided wave propagation in composites including damage using high-fidelity local interaction simulation von Li, Guoyi, Neerukatti, Rajesh Kumar, Chattopadhyay, Aditi

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Damage detection technique using ultrasonic guided waves and outlier detection: Application to interface delamination diagnosis of integrated circuit package von Lee, Hyunseong, Koo, Bonsung, Chattopadhyay, Aditi, Neerukatti, Rajesh Kumar, Liu, Kuang C.

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Gaussian Process-Based Particle-Filtering Approach for Real-Time Damage Prediction with Application von Neerukatti, Rajesh Kumar, Fard, Masoud Yekani, Chattopadhyay, Aditi

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A hybrid prognosis model for predicting fatigue crack propagation under biaxial in-phase and out-of-phase loading von Neerukatti, Rajesh Kumar, Chattopadhyay, Aditi, Iyyer, Nagaraja, Phan, Nam

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ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPRESSION BONDING von CETEGEN, Edvin, KAYA, Mine, NEERUKATTI, Rajesh Kumar, MELLODY, James, DAMBRAUSKAS, Tony, SALTAS, Mark, KAMGA, Albert

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Mechanical failure monitoring, detection, and classification in electronic assemblies von McCoy, David C, Malatkar, Pramod, Yazzie, Kyle, Yagnamurthy, Naga Sivakumar, Neerukatti, Rajesh Kumar, Prieto, Frank P

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MECHANICAL FAILURE MONITORING, DETECTION, AND CLASSIFICATION IN ELECTRONIC ASSEMBLIES von McCoy, David C, Malatkar, Pramod, Yazzie, Kyle, Yagnamurthy, Naga Sivakumar, Neerukatti, Rajesh Kumar, Prieto, Frank P

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Integrated circuit packages with patterned protective material von Chiu, Chia-Pin, Malatkar, Pramod, Yazzie, Kyle, Yagnamurthy, Naga Sivakumar, Neerukatti, Rajesh Kumar, Bautista, Joseph, Gallina, Mark J, Mamodia, Mohit, Drake, Michael Gregory

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INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL von Chiu, Chia-Pin, Malatkar, Pramod, Yazzie, Kyle, Yagnamurthy, Naga Sivakumar, Neerukatti, Rajesh Kumar, Bautista, Joseph, Gallina, Mark J, Mamodia, Mohit, Drake, Michael Gregory

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INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL von YAZZIE, Kyle, DRAKE, Michael Gregory, MALATKAR, Pramod, CHIU, Chia-Pin, NEERUKATTI, Rajesh Kumar, BAUTISTA, Joseph, MAMODIA, Mohit, YAGNAMURTHY, Naga Sivakumar, GALLINA, Mark J

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A brief review of modified conductive carbon/glass fibre reinforced composites for structural applications: Lightning strike protection, electromagnetic shielding, and strain sensi... von Das, S., Yokozeki, T.

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