Fujitsu Group's Green Purchasing Activities von Wakasugi, Satoshi, Namiki, Takahisa, Shinohara, Kensuke, Onuma, Eiko

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A new single-layer resist for 193-nm lithography von NOZAKI, K, WATANABE, K, NAMIKI, T, IGARASHI, M, KURAMITSU, Y, YANO, E

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Characteristics of Silicon-Based Negative Resists in ArF Excimer Laser Lithography von Watanabe, Keiji, Igarashi, Miwa, Yano, Ei, Namiki, Takahisa, Nozaki, Koji, Kuramitsu, Yohko

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A Bi-Level Resist System with a Conductive Bottom Layer for EB Lithography von Watanabe, Keiji, Yano, Ei, Namiki, Takahisa, Igarashi, Miwa, Kuramitsu, Yohko

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Synthesis of a new series of unsymmetrical dithiadiselenafulvalenes von Kobayashi, Keiji, Kikuchi, Koichi, Namiki, Takahisa, Ikemoto, Isao

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Polysilphenylenesiloxane Bi-level Resist -TSPS von Watanabe, Keiji, Oikawa, Akira, Namiki, Takahisa, Yoneda, Yasuhiro

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POROUS FILM-FORMING COATING LIQUID, INSULATION FILM, AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE von NAMIKI TAKAHISA

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COMPOSITION FOR LOW DIELECTRIC FILM, LOW DIELECTRIC FILM, AND SEMICONDUCTOR DEVICE von NAMIKI TAKAHISA

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BIODEGRADABLE RESIN COMPOSITION, MOLDED PRODUCT GIVEN BY USING THE SAME AND METHOD FOR DISPOSING WASTE OF THE PRODUCT von NAMIKI TAKAHISA

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Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device von KON, JUNICHI, KOZAWA, MIWA, NAMIKI, TAKAHISA, NOZAKI, KOJI

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Resistmuster-Verdickungsmaterial und Verfahren zum Ausbilden von Resistmustern, und Verfahren zum Herstellung einer Halbleitervorrichtung von KOZAWA, MIWA, NAMIKI, TAKAHISA, NOZAKI, KOJI

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PC CARD EJECTION MECHANISM von NAKAYAMA JUNICHI, NAMIKI TAKAHISA

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Unsymmetrically substituted dithiadiselenafulvalene donors for organic metals. Synthesis and conductivity of the charge-transfer salts von Kikuchi, Koichi, Namiki, Takahisa, Ikemoto, Lsao, Kobayashi, Keiji

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Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same von Kozawa, Miwa, Nozaki, Koji, Namiki, Takahisa

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Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same von Kozawa, Miwa, Nozaki, Koji, Namiki, Takahisa

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Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same von NOZAKI KOJI, KOZAWA MIWA, NAMIKI TAKAHISA

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Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same von NOZAKI KOJI, KOZAWA MIWA, NAMIKI TAKAHISA

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Biodegradable resin composition, filler therefor and molded article thereof von Nozaki, Koji, Namiki, Takahisa

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Biodegradable resin composition, filler therefor and molded article thereof von NOZAKI KOJI, NAMIKI TAKAHISA

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Biodegradable polymer composition, filler therefor and molded article thereof von NAMIKI, TAKAHISA, NOZAKI, KOJI

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