An ADPLL-Based GFSK Modulator with Two-Point Modulation for IoT Applications von Kim, Nam-Seog

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A 2.4 GHz Wide-Range CMOS Current-Mode Class-D PA with HD2 Suppression for Internet of Things Applications von Kim, Nam-Seog

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A High Data-Rate Energy-Efficient Triple-Channel UWB-Based Cognitive Radio von Nam-Seog Kim, Rabaey, Jan M.

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A Digital-Intensive Extended-Range Dual-Mode BLE5.0 and IEEE802.15.4 Transceiver SoC von Kim, Nam-Seog

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A 3.1-10.6-GHz 57-Bands CMOS Frequency Synthesizer for UWB-Based Cognitive Radios von Kim, Nam-Seog, Rabaey, Jan M.

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A Spurious and Oscillator Pulling Free CMOS Quadrature LO-Generator for Cellular NB-IoT von Choi, Jaewon, Kim, Nam-Seog

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A Dual-Resolution Wavelet-Based Energy Detection Spectrum Sensing for UWB-Based Cognitive Radios von Kim, Nam-Seog, Rabaey, Jan M.

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A 10-Bit, 600 MS/s Multi-Mode Direct-Sampling DAC-Based Transmitter von Kim, Nam-Seog

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A 14-nm 0.14-psrms Fractional-N Digital PLL With a 0.2-ps Resolution ADC-Assisted Coarse/Fine-Conversion Chopping TDC and TDC Nonlinearity Calibration von Chih-Wei Yao, Ronghua Ni, Chung Lau, Wanghua Wu, Godbole, Kunal, Yongrong Zuo, Sangsoo Ko, Nam-Seog Kim, Sangwook Han, Ikkyun Jo, Joonhee Lee, Juyoung Han, Daehyeon Kwon, Chulho Kim, Shinwoong Kim, Sang Won Son, Cho, Thomas Byunghak

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A Compact Model for Interface-Type Self-Rectifying Resistive Memory With Experiment Verification von Kim, Jin-Woo, Beom, Jun-Seok, Lee, Hong Sub, Kim, Nam-Seog

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8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology von KANG, Uksong, CHUNG, Hoe-Ju, LEE, Jae-Wook, JOO, Han-Sung, KIM, Woo-Seop, DONG HYEON JANG, NAM SEOG KIM, CHOI, Jung-Hwan, CHUNG, Tae-Gyeong, YOO, Jei-Hwan, JOO SUN CHOI, KIM, Changhyun, HEO, Seongmoo, JUN, Young-Hyun, PARK, Duk-Ha, LEE, Hoon, JIN HO KIM, AHN, Soon-Hong, CHA, Soo-Ho, AHN, Jaesung, KWON, Dukmin

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Denoising traffic collision data using Ensemble Empirical Mode Decomposition (EEMD) and its application for constructing Continuous Risk Profile (CRP) von Kim, Nam-Seog, Chung, Koohong, Ahn, Seongchae, Yu, Jeong Whon, Choi, Keechoo

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8Gb 3D DDR3 DRAM using through-silicon-via technology von Uksong Kang, Hoe-Ju Chung, Seongmoo Heo, Soon-Hong Ahn, Hoon Lee, Soo-Ho Cha, Jaesung Ahn, DukMin Kwon, Jin Ho Kim, Jae-Wook Lee, Han-Sung Joo, Woo-Seop Kim, Hyun-Kyung Kim, Eun-Mi Lee, So-Ra Kim, Keum-Hee Ma, Dong-Hyun Jang, Nam-Seog Kim, Man-Sik Choi, Sae-Jang Oh, Jung-Bae Lee, Tae-Kyung Jung, Jei-Hwan Yoo, Changhyun Kim

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A 10-bit, 600 MS/s Multi-mode Direct-Sampling DAC-based Transmitter for TV Band Cognitive Radio von Kim, Nam-Seog

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Synchronous mirror delay for multiphase locking von Yoon, Y.J., Kwon, H.I., Lee, J.D., Park, B.G., Kim, N.S., Cho, U.R., Byun, H.G.

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A 0.2 to 1.7 GHz low-jitter integer-N QPLL for power efficient direct digital RF modulator von Nam-Seog Kim, Rabaey, Jan M.

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Reliability studies on micro-bumps for 3-D TSV integration von Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim

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Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures von Tengfei Jiang, Suk-Kyu Ryu, Im, Jay, Ho-Young Son, Nam-Seog Kim, Rui Huang, Ho, Paul S.

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Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction von Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Chia, Pierre, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.

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Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration von Young-Bae Park, Seung-Hyun Kim, Jong-Jin Park, Kim, June-Bum, Ho-Young Son, Kwon-Whan Han, Jae-Sung Oh, Nam-Seog Kim, Sehoon Yoo

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