Semiconductor Logic Technology Innovation to Achieve Sub-10 nm Manufacturing von Schuegraf, K., Abraham, M. C., Brand, A., Naik, M., Thakur, R.

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Qualitative and quantitative salivary changes and subjective oral dryness among patients with thyroid dysfunction von Naik, Meghal, Vassandacoumara, Vaishnavee

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Low temperature thermal ALD TaNx and TiNx films from anhydrous N2H4 von Wolf, Steven, Breeden, Michael, Kwak, Iljo, Park, Jun H., Kavrik, Mahmut, Naik, Mehul, Alvarez, Daniel, Spiegelman, Jeffrey, Kummel, Andrew C.

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CVD Al/PVD Al integration for advanced via and interconnect technology von Beinglass, Israel, Naik, Mehul

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A mixed-methods analysis of a collaborative online international pharmacy course von Kim, Rory E., Church, Terry D., Ghate, Manjunath, Patel, Mayur, Mehta, Tejal, Naik, Mehul, Graham, Terrence F., Haworth, Ian S.

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Integration Challenges for CMP of Copper von Bajaj, Rajeev, Zutshi, Ajoy, Surana, Rahul, Naik, Mehul, Pan, Tony

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Audio-Visual Person Recognition Using Deep Convolutional Neural Networks von Naik, Mehul, Vegad, Sagar, Patel, Harsh, Zhuang, Hanqi

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Digital leadership in action in a hospital through a real time dashboard system implementation and experience von Weiner, Jack, Tanniru, Mohan, Khuntia, Jiban, Bobryk, David, Naik, Mehul, LePage, Kenneth

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Doped selective metal caps to improve copper electromigration with ruthenium liner von Wu, Zhiyuan, Naik, Mehul B

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Designing wideband voltage controlled oscillators for Software-Defined Radio von Naik, Mehul R, Vithalani, C H

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Fully aligned subtractive processes and electronic devices therefrom von Ren, He, Naik, Mehul, Jiang, Hao

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Method of forming nickel silicide materials von Ren, He, Yu, Minrui, Naik, Mehul

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Doped selective metal caps to improve copper electromigration with ruthenium liner von Wu, Zhiyuan, Naik, Mehul B

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(Invited) Dielectric Damage von Shohet, J. Leon, Lin, Qinghuang, King, Sean W., Ren, He, Banna, Samer, Jakes, Joseph E., Agasie, Robert J., Naik, Mehul, Nishi, Yoshio, Nichols, Michael T., Mavrakakis, Konstantinos, Hsu, Kaiwen, Guo, Xiangyu, Pei, Dongfei, Li, Weiyi, Choudhury, Faraz, Zheng, Huifeng

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FULLY ALIGNED SUBTRACTIVE PROCESSES AND ELECTRONIC DEVICES THEREFROM von NAIK, Mehul, REN, He, JIANG, Hao

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Integrated contact silicide with tunable work functions von Naik, Mehul, Hung, Raymond, Haverty, Michael

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INTEGRATED CONTACT SILICIDE WITH TUNABLE WORK FUNCTIONS von NAIK, Mehul, HAVERTY, Michael, HUNG, Raymond

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INTEGRATED CONTACT SILICIDE WITH TUNABLE WORK FUNCTIONS von NAIK, Mehul, HAVERTY, Michael, HUNG, Raymond

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Novel Hardmask for Sub-20nm Copper/Low K Backend Dual Damascene Integration von Xia, Li-Qun, Cui, Zhenjiang, Balseanu, Mihaela, Nguyen, Victor, Zhou, Kevin, Pender, Jeremiah, Naik, Mehul

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SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES von NAIK, Mehul B, REN, He, JIANG, Hao, YOU, Shi

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