Electrochemical Atomic Layer Deposition (E-ALD) of Pt Nanofilms Using SLRR Cycles von Jayaraju, Nagarajan, Vairavapandian, Deepa, Kim, Youn Guen, Banga, Dhego, Stickney, John L.

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PtRu Nanofilm Formation by Electrochemical Atomic Layer Deposition (E-ALD) von Jayaraju, Nagarajan, Banga, Dhego, Thambidurai, Chandru, Liang, Xuehai, Kim, Youn-Guen, Stickney, John L

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Electrochemical Atomic Layer Deposition (E-ALD) of Palladium Nanofilms by Surface Limited Redox Replacement (SLRR), with EDTA Complexation von Sheridan, Leah B., Czerwiniski, Justin, Jayaraju, Nagarajan, Gebregziabiher, Daniel K., Stickney, John L., Robinson, David B., Soriaga, Manuel P.

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Controlled Electrochemical Formation of Ge x Sb y Te z using Atomic Layer Deposition (ALD) von Liang, Xuehai, Jayaraju, Nagarajan, Thambidurai, Chandru, Zhang, Qinghui, Stickney, John L

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Formation of HgCdTe by Electrochemical Atomic Layer Epitaxy (EC-ALE) von Venkatasamy, Venkatram, Jayaraju, Nagarajan

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Deposition of HgTe by electrochemical atomic layer epitaxy (EC-ALE) von Venkatasamy, Venkatram, Jayaraju, Nagarajan, Cox, Stephen M., Thambidurai, Chandru, Mathe, Mkhulu, Stickney, John L.

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Method of filling through-holes to reduce voids and other defects von Barstad, Leon, Jayaraju, Nagarajan

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS von Barstad, Leon, Jayaraju, Nagarajan

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Aqueous Ge Atomic Layer Deposition on Au von Liang, Xuehai, Jayaraju, Nagarajan, Stickney, John L.

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Copper Nano Film Formation Using Electrochemical ALD von Thambidurai, Chandru, Jayaraju, Nagarajan, Kim, Youn-Geun, Stickney, John L.

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS von Jayaraju Nagarajan, Barstad Leon

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS von Barstad, Leon, Jayaraju, Nagarajan

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS von Dziewiszek, Joanna J, John, Jimmy, Thoresen, Derek J, Niazimbetova, Zuhra I, Jayaraju, Nagarajan

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS von JOHN, Jimmy, JAYARAJU, Nagarajan, DZIEWISZEK, Joanna J, THORESEN, Derek J, NIAZIMBETOVA, Zuhra I

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METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS von Niazimbetova, Zuhra, Barstad, Leon, Jayaraju, Nagarajan, Dziewiszek, Joanna

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Method of filling through-holes to reduce voids and other defects von Niazimbetova, Zuhra, Barstad, Leon, Jayaraju, Nagarajan, Dziewiszek, Joanna

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METHOD OF REDUCING VOIDS AND OTHER DEFECTS BY FILLING THROUGH-HOLE von NAGARAJAN JAYARAJU, LEON BARSTAD

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Filling through-holes von Najjar, Elie H, Barstad, Leon R, Jayaraju, Nagarajan

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Monolayer Restricted Galvanic Displacement (MRGD) for the Growth of Pt/Ru Alloy Nanofilms via Electrochemical Atomic Layer Deposition (E-ALD)and the Oxidation of CO von Jayaraju, Nagarajan, Stickney, J. L.

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Method of filling through-holes to reduce voids and other defects von BARSTAD, LEON, JAYARAJU, NAGARAJAN

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