High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device von Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses von Kim, Dongjin, Lee, Sangmin, Chen, Chuantong, Lee, Seung-Joon, Nagao, Shijo, Suganuma, Katsuaki

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One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices von Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

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Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term sta... von Li, Wanli, Li, Lingying, Gao, Yue, Hu, Dawei, Li, Cai-Fu, Zhang, Hao, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys von Liu, Jian-Chun, Park, SungWon, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Ma, Ju-Sheng, Zhang, Gong, Suganuma, Katsuaki

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Silver Nanowire Electrodes: Conductivity Improvement Without Post-treatment and Application in Capacitive Pressure Sensors von Wang, Jun, Jiu, Jinting, Araki, Teppei, Nogi, Masaya, Sugahara, Tohru, Nagao, Shijo, Koga, Hirotaka, He, Peng, Suganuma, Katsuaki

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Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles von Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design von Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

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Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate von Li, Wanli, Cong, Shuren, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature von Kunimune, Teppei, Kuramoto, Masafumi, Ogawa, Satoru, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

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Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices von Sakamoto, Soichi, Nagao, Shijo, Suganuma, Katsuaki

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Nano-volcanic Eruption of Silver von Lin, Shih-kang, Nagao, Shijo, Yokoi, Emi, Oh, Chulmin, Zhang, Hao, Liu, Yu-chen, Lin, Shih-guei, Suganuma, Katsuaki

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Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering von Araki, Teppei, Sugahara, Tohru, Jiu, Jinting, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Uchida, Hiroshi, Shinozaki, Kenji, Suganuma, Katsuaki

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Dry-growth of silver single-crystal nanowires from porous Ag structure von Chen, Chuantong, Nagao, Shijo, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki

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Growth and Extension of One-Step Sol–Gel Derived Molybdenum Trioxide Nanorods via Controlling Citric Acid Decomposition Rate von Cong, Shuren, Sugahara, Tohru, Wei, Tingting, Jiu, Jinting, Hirose, Yukiko, Nagao, Shijo, Suganuma, Katsuaki

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Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure von Kim, Dongjin, Chen, Chuantong, Suetake, Aiji, Choe, Chanyang, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

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Use of graphene oxide in achieving high overall thermal properties of polymer for printed electronics von Zhou, Tianle, Liu, Fei, Suganuma, Katsuaki, Nagao, Shijo

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Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition von Gao, Yue, Takata, Shuhei, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Bahman, Amir Sajjad, Iannuzzo, Francesco

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Hillock growth dynamics for Ag stress migration bonding von Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement von Li, Wanli, Zhang, Hao, Gao, Yue, Jiu, Jinting, Li, Cai-Fu, Chen, Chuantong, Hu, Dawei, Goya, Yusuke, Wang, Yutao, Koga, Hirotaka, Nagao, Shijo, Suganuma, Katsuaki

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