Treffer 1 - 3 von 3 für Suche 'Myo, Eipa', Suchdauer: 0,24s Treffer weiter einschränken
  1. 1
    Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

    Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer von Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

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  2. 2
    Ultra thinning of wafer for embedded wafer packaging

    Ultra thinning of wafer for embedded wafer packaging von Lee Wen Sheng, Khan, N., Kek, J., Chua, H.S., Tsutsumi, Y., Yew, L.C., Ho Soon Wee, Eipa, M., Vempati, S., Kripesh, V., Sundaram, V.

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  3. 3
    Assembly of large dies fine pitch Cu/low-k FCBGA package with through silicon via (TSV) interposer

    Assembly of large dies fine pitch Cu/low-k FCBGA package with through silicon via (TSV) interposer von Wai, Leong Ching, Zhang, Xiaowu, Chai, T.C., Srinivas, Vempati Rao, Ho, David, Pinjala, D., Myo, Eipa, Jong, M.C., Lim, Sharon, Ong, Joe, Thew, Serene, Chen, Kelvin, Shekar, Varsala N.

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