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  1. 1
    Influence of different chemical surface patterns on the dynamic wetting behaviour on flat and silanized silicon wafers during inclining-plate measurements: An experimental investigation with the high-precision drop shape analysis approach

    Influence of different chemical surface patterns on the dynamic wetting behaviour on flat and silanized silicon wafers during inclining-plate measurements: An experimental investig... von Heib, F., Munief, W.M., Ingebrandt, S., Hempelmann, R., Schmitt, M.


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  2. 2
    High-precision drop shape analysis (HPDSA) of quasistatic contact angles on silanized silicon wafers with different surface topographies during inclining-plate measurements: Influence of the surface roughness on the contact line dynamics

    High-precision drop shape analysis (HPDSA) of quasistatic contact angles on silanized silicon wafers with different surface topographies during inclining-plate measurements: Influe... von Heib, F., Hempelmann, R., Munief, W.M., Ingebrandt, S., Fug, F., Possart, W., Groß, K., Schmitt, M.

    Veröffentlicht in Applied surface science

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