America West Airlines Develops Efficient Boarding Strategies von van den Briel, Menkes H. L, Villalobos, J. Rene, Hogg, Gary L, Lindemann, Tim, Mule, Anthony V

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Quasi-free-space optical coupling between diffraction grating couplers fabricated on independent substrates von Mulé, Anthony V, Villalaz, Ricardo, Gaylord, Thomas K, Meindl, James D

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Chip-to-Module Interconnections Using “Sea of Leads” Technology von Bakir, Muhannad S., Reed, Hollie A., Mulé, Anthony V., Jayachandran, Joseph Paul, Kohl, Paul A., Martin, Kevin P., Gaylord, Thomas K., Meindl, James D.

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Electrical and optical clock distribution networks for gigascale microprocessors von Mule, A.V., Glytsis, E.N., Gaylord, T.K., Meindl, J.D.

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Wafer-Testing of Optoelectonic-Gigascale CMOS Integrated Circuits von Thacker, H D, Ogunsola, O O, Muler, A V, Meindl, J D

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The clock distribution of the POWER4 microprocessor von Restle, P.J., Carter, C.A., Eckhardt, J.P., Krauter, B.L., McCredie, B.D., Jenkins, K.A., Weger, A.J., Mule, A.V.

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Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection von Bakir, M.S., Reed, H.A., Mule, A.V., Kohl, P.A., Martin, K.P., Meindl, J.D.

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Optical and electrical interconnect partition length based on chip-to-chip bandwidth maximization von Naeemi, A., Jianping Xu, Mule', A.V., Gaylord, T.K., Meindl, J.D.

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Photopolymer-based diffractive and MMI waveguide couplers von Mule', A.V., Villalaz, R., Gaylord, T.K., Meindl, J.D.

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Multi-layer etch stop layers for advanced integrated circuit structure fabrication von Seghete, Dragos, Ryder, Christopher R, Towner, David J, Aquino Gonzalez, Angel, Mule', Anthony V

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Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication von Mule', A.V., Villalaz, R.A., Joseph, P.J., Naeemi, A., Kohl, P.A., Gaylord, T.K., Meindl, J.D.

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COPPER INTERCONNECT CLADDING von TRICHY, Gopinath, GRIGGIO, Flavio, YASHAR, Philip, MULE, Anthony V, MALYAVANATHAM, Gokul

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MULTI-LAYER ETCH STOP LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION von RYDER, Christopher R, MULE', Anthony V, TOWNER, David J, SEGHETE, Dragos, AQUINO GONZALEZ, Angel

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Copper interconnect cladding von Malyavanatham, Gokul, Yashar, Philip, Griggio, Flavio, Mule, Anthony V, Trichy, Gopinath

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Two-material, air-clad, grating-in-the-waveguide optical interconnects von Mule, A.V., Villalaz, R., Gaylord, T.K., Meindl, J.D.

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COPPER INTERCONNECT CLADDING von Malyavanatham, Gokul, Yashar, Philip, Griggio, Flavio, Mule, Anthony V, Trichy, Gopinath

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MEHRSCHICHTÄTZSTOPPSCHICHTEN ZUR FORTSCHRITTLICHEN INTEGRIERTER-SCHALTKREIS-STRUKTUR-HERSTELLUNG von Seghete, Dragos, Ryder, Christopher R, Towner, David J, Aquino Gonzalez, Angel, Mule', Anthony V

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A 10 GHz hybrid optical/electrical clock distribution network for gigascale integration von Mule, A.V., Schultz, S.M., Gaylord, T.K., Meindl, J.D.

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