Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures von Chan, Mu-Hsuan, Lu, Fu-Hsing

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Preparation of titanium oxynitride thin films by reactive sputtering using air/Ar mixtures von Chan, Mu-Hsuan, Lu, Fu-Hsing

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Preparation of ZrNxOy films by magnetron sputtering using air as a reactive gas von CHAN, Mu-Hsuan, WU, Po-Lun, LU, Fu-Hsing

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Air-Based Deposition of Conductive Nitride Thin Films by Sputtering von Chan, Mu-Hsuan, Lu, Fu-Hsing

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X-ray photoelectron spectroscopy analyses of titanium oxynitride films prepared by magnetron sputtering using air/Ar mixtures von Chan, Mu-Hsuan, Lu, Fu-Hsing

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Characterization of Cr-doped TiO2 thin films prepared by cathodic arc plasma deposition von CHAN, Mu-Hsuan, HO, Wei-Yu, WANG, Da-Yung, LU, Fu-Hsing

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Air-based deposition and processing windows of sputtered TiN, TiNxOy, and N-doped TiOx thin films von Chan, Mu-Hsuan, Lu, Fu-Hsing

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Influences of oxygen impurity contained in nitrogen on the reaction of titanium with nitrogen von Lu, Fu-Hsing, Jiang, Bor-Feng, Lo, Jen-Li, Chan, Mu-Hsuan

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Characteristics of chromium-doped titanium oxide coatings synthesized by cathodic arc deposition von Ho, Wei-Yu, Chan, Mu-Hsuan, Yao, Kao-Shan, Chang, Chi-Lung, Wang, Da-Yung, Hsu, Cheng-Hsun

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Underfill adhesion enhancement via optimization of plasma treatment for 3DIC von Chi-Tung Yeh, Huei-Nuan Huang, Pai-Yuan Lee, Mu-Hsuan Chan, Lin, G. T., Chiu, Steve

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Heat-resistance study of thermal release tape von Chieh-Yuan Chi, Chun-Tang Lin, Jung-Pang Huang, Mu-Hsuan Chan, Yan-Yi Liao, Yan-Heng Chen, Wei-Yu Chen

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Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package von Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin, Kuan-Weir Chuang, Huei-Nuan Huang, Chi-Tung Yeh, Wen-Tsung Tseng, Jeng-Yuan Lai

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Effective 3DIC chip module warpage with UF design by analytical method von Pai-Yuan Lee, Chi-Tung Yeh, Huei-Nuan Huang, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike

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High thermal conductivity underfill study for fine pitch Cu pillar bump von Huei-Nuan Huang, Mei-Chin Lee, Chi-Tung Yeh, Pai-Yuan Lee, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike

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Preparation of ZrN x O y films by magnetron sputtering using air as a reactive gas von Chan, Mu-Hsuan, Wu, Po-Lun, Lu, Fu-Hsing

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Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures von CHAN, Mu-Hsuan, LU, Fu-Hsing

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A study on the 3DIC interconnection using thermal compression bond with non conductive paste process von Mu-Hsuan Chan, Huei-Nuan Huang, Chien-Feng Chan, Chun-Tang Lin, Yang, M-H, Jeng Yuan Lai

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Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections von Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Pin Huang, Mu-Hsuan Chan, Chun-Tang Lin, Liu, M., Chi-Hsin Chiu, Chiu, S., Ma, M.

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Reliability of thermal compression bond combine with non conductive paste process in fine pitch micro-bumps soldering von Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Mu-Hsuan Chan, Chun-Tang Lin, Chi-Hsin Chiu

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Characterization of Cr-doped TiO 2 thin films prepared by cathodic arc plasma deposition von Chan, Mu-Hsuan, Ho, Wei-Yu, Wang, Da-Yung, Lu, Fu-Hsing

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