The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9 von Mahayri, Roland, Bousnina, Mohammed Ali, Mercone, Silvana, Tan, Ky-Lim, Morelle, Jean-Michel, Schoenstein, Frédéric, Jouini, Noureddine

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Synthesis and characterization of poly(aminobismaleimide)s obtained from solvent‐free mixtures von Soisson, Arnaud, Chikh, Linda, Banet, Philippe, Morelle, Jean‐Michel, Fichet, Odile

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Synthesis of Ag3Sn Submicrometer Particles via an Adapted Polyol Process in View of Their Use As Die-Attach Material in Power Modules von Canaud, Pauline, Mahayri, Roland, Schoenstein, Frédéric, Gautron, Eric, Tan, Ky-Lim, Chauveau, Thierry, Morelle, Jean-Michel, Maroteaux, Fadila, Jouini, Noureddine

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A design of a new miniature device for solder joints’ mechanical properties evaluation von Tao, Quang-Bang, Benabou, Lahouari, Vivet, Laurent, Tan, Ky-Lim, Morelle, Jean-Michel, Le, Van-Nhat, Ben Ouezdou, Fathi

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The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag 5 Sn 0.9 von Mahayri, Roland, Bousnina, Mohammed Ali, Mercone, Silvana, Tan, Ky-Lim, Morelle, Jean-Michel, Schoenstein, Frédéric, Jouini, Noureddine

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The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag[sub.5]Sn[sub.0.9] von Mahayri, Roland, Bousnina, Mohammed Ali, Mercone, Silvana, Tan, Ky-Lim, Morelle, Jean-Michel, Schoenstein, Frédéric, Jouini, Noureddine

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Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag$$_{3}$$Sn-based materials, sintered by SPS in view of die-attachment applications von Mahayri, R., Mercone, S., Giovannelli, F., Tan, K.-L., Morelle, J.-M., Jouini, N., Schoenstein, F.

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Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode von Dupont, L., Blanchard, J.L., Lallemand, R., Coquery, G., Morelle, J.M., Blondel, G., Rouleau, B.

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Electronic power module with integrated capacitance von Morliere, Benjamin, Morelle, Jean-Michel

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FORMULATION D'UN COMPOSE INTERMETALLIQUE AG-SN von CANAUD, PAULINE, MORELLE, JEAN-MICHEL, TAN, KY LIM, SCHOENSTEIN, FREDERIC, JOUINI, NOUREDDINE, MAROTEAUX, FADILA

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ASSEMBLAGE D'UN MODULE ELECTRONIQUE DE PUISSANCE ET D'UNE CARTE PCB A FAIBLE ENCOMBREMENT von MORELLE JEAN-MICHEL, MORLIERE BENJAMIN

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MODULE ELECTRONIQUE DE PUISSANCE A CAPACITE INTEGREE von MORELLE JEAN-MICHEL, MORLIERE BENJAMIN

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Automotive vehicle lighting device with electrical connection circuit board connected to substrate by anisotropic conductive film von Zojceski, Zdravko, Duarte, Marc, Morelle, Jean-Michel

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BRAZING PROCESS INVOLVING SINTERING A CONDUCTIVE POWDER BY ULTRASONIC THERMOCOMPRESSION AND ELECTRONIC POWER MODULE PRODUCED BY THIS PROCESS von TAN, Ky Lim, MORELLE, Jean-Michel

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élément de liaison destiné à mettre en contact thermique UNE PIECE A REFROIDIR ET UN DISSIPATEUR DE CHALEUR von TAN, Ky Lim, MORELLE, Jean Michel, CANITROT, Didier

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FORMULATION OF AN AG-SN INTERMETALLIC COMPOUND von TAN, Ky Lim, MAROTEAUX, Fadila, SCHOENSTEIN, Frédéric, MORELLE, Jean-Michel, JOUINI, Noureddine, CANAUD, Pauline

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CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK von MORELLE, Jean Michel, TAN, Ky-Lim, CANITROT, Didier

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CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK von MORELLE, Jean Michel, TAN, Ky-Lim, CANITROT, Didier

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ILLUMINATION OR SIGNALING DEVICE FOR AUTOMOTIVE VEHICLE von Morelle Jean-Michel, DUARTE Marc, Zojceski Zdravko

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élément de liaison destiné à mettre en contact thermique UNE PIECE A REFROIDIR ET UN DISSIPATEUR DE CHALEUR von TAN, Ky Lim, MORELLE, Jean Michel, CANITROT, Didier

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