Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive von Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae

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Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder von Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Jong‐Tae, Nam, Jae‐Do

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Characterization of polymer matrix and low melting point solder for anisotropic conductive film von Eom, Yong-Sung, Baek, Ji-Won, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min

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Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder von Baek, Ji-Won, Jang, Keon-Soo, Eom, Yong-Sung, Moon, Jong-Tae, Kim, Jong-Min, Nam, Jae-Do

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Novel Bumping Material for Solder‐on‐Pad Technology von Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung

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Novel Maskless Bumping for 3D Integration von Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung

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Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs von KIM, Sungil, EOM, Yong-Sung, LEE, Chul-Wook, BAEK, Yongsoon, MOON, Jong-Tae, KANG, Kwang-Yong, LEE, Hai-Young

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Synthesis of Spherical TiO2 Particles with Disordered Rutile Surface for Photocatalytic Hydrogen Production von Kim, Na Yeon, Lee, Hyeon Kyeong, Moon, Jong Tae, Joo, Ji Bong

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Controllable one-pot synthesis of uniform colloidal TiO2 particles in a mixed solvent solution for photocatalysis von Moon, Jong Tae, Lee, Seung Ki, Joo, Ji Bong

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Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis von Yoon, Hyungseok, Choi, Kwang-Seong, Bae, Hyun-Cheol, Moon, Jong-Tae, Eom, Yong-Sung, Jeon, Insu

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On the formation of MoSi2 by self-propagating high-temperature synthesis von JO, S.-W, LEE, G.-W, MOON, J.-T, KIM, Y.-S

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Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder von Eom, Yong-Sung, Jang, Keonsoo, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min

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Development of Packaging Technologies for High-Speed ( ≫40Gb/s) Optical Modules von Choi, K.-S., Kwon, Y.-H., Choe, J.-S., Chung, Y.-D., Kang, Y.-S., Kim, J., Ahn, B.-T., Moon, J.-T.

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Right‐Angle‐Bent CPW for the Application of the Driver‐Amplifier‐Integrated 40 Gbps TW‐EML Module von Yun, Ho‐Gyeong, Choi, Kwang‐Seong, Kwon, Yong‐Hwan, Choe, Joong‐Seon, Moon, Jong‐Tae, Lee, Myung‐Hyun

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New Impedance Matching Scheme for 60 GHz Band Electro‐Absorption Modulator Modules von Choi, Kwang‐Seong, Chung, Yong‐Duck, Kang, Young‐Shik, Jun, Dong‐Suk, Ahn, Byoung‐Tae, Moon, Jong‐Tae, Kim, Jeha

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Reliability of composite solder bumps produced by an in-situ process von LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, DONG HYUK SHIN, KIM, Yong-Seog

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Clinical significance of insulin receptor substrate-I down-regulation in non-small cell lung cancer von Han, Chang Hoon, Cho, Jae Yong, Moon, Jong Tae, Kim, Hyung Jung, Kim, Se Kyu, Shin, Dong Hwan, Chang, Joon, Ahn, Chul Min, Kim, Sung Kyu, Chang, Yoon Soo

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Surface-Mountable 10 Gbps Photoreceiver Module Using Inductive Compensation Method von Kim, Sung‐IL, Hong, Seon‐Eui, Lim, Jong‐Won, Moon, Jong‐Tae

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Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering von LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, SHIN, Dong-Hyuk, KIM, Yong-Seog

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Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive von Eom, Yong-Sung, Choi, Kwang-Seong, Moon, Seok-Hwan, Park, Jun-Hee, Lee, Jong-Hyun, Moon, Jong-Tae

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