The Externalizing and Internalizing Pathways to Marijuana Use Initiation: Examining the Synergistic Effects of Impulsiveness and Sensation Seeking von Wasserman, Alexander M., Shaw-Meadow, K. J., Moon, T. J., Karns-Wright, T. E., Mathias, C. W., Hill-Kapturczak, N., Dougherty, D. M.

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Development of the Level-1 track trigger with Central Drift Chamber detector in Belle II experiment and its performance in SuperKEKB 2019 Phase 3 operation von Lai, Y. -T., Aoyama, M., Bae, H., Baehr, S., Chang, M. -C., Hayashii, H., Iwasaki, Y., Kim, J. -B., Kim, K. -T., Kiesling, C., Koga, T., Lu, P. -C., Liu, S. -M., Meggendorfer, F., Moon, H. -K., Moon, T. -J., Nakazawa, H., Rados, P., Rostomyan, A., Shiu, J. -G., Skambraks, S., Sheng, T. -A., Sue, Y., Unger, K., Wang, C. -H., Won, E., Yin, J.

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Optical deformability of soft biological dielectrics von Guck, J, Ananthakrishnan, R, Moon, T J, Cunningham, C C, Käs, J

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Flame-retardant Polyamide 11 and 12 Nanocomposites: Processing, Morphology, and Mechanical Properties von Lao, S.C., Yong, W., Nguyen, K., Moon, T.J., Koo, J.H., Pilato, L., Wissler, G.

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Flame-retardant Polyamide 11 and 12 Nanocomposites: Thermal and Flammability Properties von Lao, S.C., Wu, C., Moon, T.J., Koo, J.H., Morgan, A., Pilato, L., Wissler, G.

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Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding von Rezvani, A., Shah, A., Mayer, M., Zhou, Y., Moon, J.T.

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Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force von Hang, C.J., Song, W.H., Lum, I., Mayer, M., Zhou, Y., Wang, C.Q., Moon, J.T., Persic, J.

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Immunostimulatory nanoparticle incorporating two immune agonists for the treatment of pancreatic tumors von Lorkowski, M.E., Atukorale, P.U., Bielecki, P.A., Tong, K.H., Covarrubias, G., Zhang, Y., Loutrianakis, G., Moon, T.J., Santulli, A.R., Becicka, W.M., Karathanasis, E.

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Observation of Coulomb-Assisted Nuclear Bound State of Xi(-) -N-14 System von Hayakawa, S. H., Agari, K., Ahn, J. K., Akaishi, T., Akazawa, Y., Ashikaga, S., Bassalleck, B., Bleser, S., Ekawa, H., Endo, Y., Fujikawa, Y., Fujioka, N., Fujita, M., Goto, R., Han, Y., Hasegawa, S., Hashimoto, T., Hayakawa, T., Hayata, E., Hicks, K., Hirose, E., Hirose, M., Honda, R., Hoshino, K., Hoshino, S., Hosomi, K., Hwang, S. H., Ichikawa, Y., Ichikawa, M., Imai, K., Inaba, K., Ishikawa, Y., Ito, H., Ito, K., Jung, W. S., Kanatsuki, S., Kanauchi, H., Kasagi, A., Kawai, T., Kim, M. H., Kim, S. H., Kinbara, S., Kiuchi, R., Kobayashi, H., Kobayashi, K., Koike, T., Koshikawa, A., Lee, J. Y., Ma, T. L., Matsumoto, S. Y., Minakawa, M., Miwa, K., Moe, A. T., Moon, T. J., Moritsu, M., Nagase, Y., Nakada, Y., Nakagawa, M., Nakashima, D., Nakazawa, K., Nanamura, T., Naruki, M., Nyaw, A. N. L., Ogura, Y., Ohashi, M., Oue, K., Ozawa, S., Pochodzalla, J., Ryu, S. Y., Sako, H., Sato, S., Sato, Y., Schupp, F., Shirotori, K., Soe, M. M., Soe, M. K., Sohn, J. Y., Sugimura, H., Suzuki, K. N., Takahashi, H., Takahashi, T., Takeda, T., Tamura, H., Tanida, K., Theint, A. M. M., Tint, K. T., Toyama, Y., Ukai, M., Umezaki, E., Watabe, T., Watanabe, K., Yamamoto, T. O., Yang, S. B., Yoon, C. S., Yoshida, J., Yoshimoto, M., Zhang, D. H., Zhang, Z.

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Investigation of recrystallization and grain growth of copper and gold bonding wires von CHO, Jae-Hyung, ROLLETT, A. D, CHO, J.-S, PARK, Y.-J, MOON, J.-T, OH, K. H

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Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding von Pequegnat, A., Hang, C. J., Mayer, M., Zhou, Y., Moon, J. T., Persic, J.

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First determination of the spin and parity of the charmed-strange baryon Ξ c ( 2970 ) von Moon, T. J., Tanida, K., Kato, Y., Kim, S. K., Adachi, I., Ahn, J. K., Aihara, H., Al Said, S., Asner, D. M., Aulchenko, V., Aushev, T., Ayad, R., Babu, V., Bahinipati, S., Behera, P., Beleño, C., Bennett, J., Bessner, M., Bhuyan, B., Bilka, T., Biswal, J., Bonvicini, G., Bozek, A., Bračko, M., Browder, T. E., Campajola, M., Cao, L., Červenkov, D., Chang, M.-C., Chang, P., Chen, A., Cheon, B. G., Chilikin, K., Cho, K., Choi, S.-K., Choi, Y., Choudhury, S., Cinabro, D., Cunliffe, S., Dash, N., De Nardo, G., Di Capua, F., Doležal, Z., Dong, T. V., Dossett, D., Dubey, S., Eidelman, S., Epifanov, D., Ferber, T., Fulsom, B. G., Garg, R., Gaur, V., Gabyshev, N., Garmash, A., Giri, A., Goldenzweig, P., Golob, B., Hadjivasiliou, C., Hartbrich, O., Hayasaka, K., Hayashii, H., Hedges, M. T., Hou, W.-S., Hsu, C.-L., Inami, K., Inguglia, G., Ishikawa, A., Itoh, R., Iwasaki, M., Iwasaki, Y., Jacobs, W. W., Jia, S., Jin, Y., Joo, K. K., Kang, K. H., Karyan, G., Kawasaki, T., Kichimi, H., Kiesling, C., Kim, B. H., Kim, D. Y., Kim, K. T., Kim, S. H., Kim, Y. J., Kim, Y.-K., Kimmel, T. D., Kinoshita, K., Kodyš, P., Korpar, S., Kotchetkov, D., Križan, P., Kroeger, R., Krokovny, P., Kuhr, T., Kumar, R., Kumara, K., Kuzmin, A., Kwon, Y.-J., Lee, I. S., Lee, J. Y.

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Experimental investigation of the impact of LWR on sub-100-nm device performance von Hyun-Woo Kim, Ji-Young Lee, Shin, J., Sang-Gyun Woo, Han-Ku Cho, Joo-Tae Moon

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Perceived Pubertal Timing and Deviant Peer Processes Predicting Substance Use Initiation: The Moderating Role of Impulsiveness von Wasserman, A. M., Karns-Wright, T. E., Mathias, C. W., Moon, T. J., Hill-Kapturczak, N., Dougherty, D. M.

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Recrystallization and grain growth of cold-drawn gold bonding wire von CHO, J.-H, CHO, J.-S, MOON, J.-T, LEE, J, CHO, Y. H, KIM, Y. W, ROLLETT, A. D, OH, K. H

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Electrical observations of filamentary conductions for the resistive memory switching in NiO films von Kim, D. C., Seo, S., Ahn, S. E., Suh, D.-S., Lee, M. J., Park, B.-H., Yoo, I. K., Baek, I. G., Kim, H.-J., Yim, E. K., Lee, J. E., Park, S. O., Kim, H. S., Chung, U-In, Moon, J. T., Ryu, B. I.

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Al2O3 nanotubes and nanorods fabricated by coating and filling of carbon nanotubes with atomic-layer deposition von LEE, J. S, MIN, B, CHO, K, KIM, S, PARK, J, LEE, Y. T, KIM, N. S, LEE, M. S, PARK, S. O, MOON, J. T

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Al2O3 coating of ZnO nanorods by atomic layer deposition von MIN, B, LEE, J. S, MOON, J. T, HWANG, J. W, KEEM, K. H, KANG, M. I, CHO, K, SUNG, M. Y, KIM, S, LEE, M.-S, PARK, S. O

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Low-Stress Thermosonic Copper Ball Bonding von Shah, A., Mayer, M., Zhou, Y.N., Hong, S.J., Moon, J.T.

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Improvement of resistive memory switching in NiO using IrO2 von Kim, D. C., Lee, M. J., Ahn, S. E., Seo, S., Park, J. C., Yoo, I. K., Baek, I. G., Kim, H. J., Yim, E. K., Lee, J. E., Park, S. O., Kim, H. S., Chung, U-In, Moon, J. T., Ryu, B. I.

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