Honeybees, Apis cerana colony performance in the non-protected and protected beehive methods in relation to climatic factors von Muhammad Shakir, Z., Mohd Rasdi, Z., Mohd Salleh, D.

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Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates von Mohd Salleh, M.A.A., McDonald, S.D., Nogita, K.

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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces von Mohd Salleh, M.A.A., McDonald, S.D., Yasuda, H., Sugiyama, A., Nogita, K.

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Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles von Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Yasuda, H., Nogita, K.

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Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process von Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H., Nogita, K.

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Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy von Mohd Salleh, M.A.A., McDonald, S.D., Terada, Y., Yasuda, H., Nogita, K.

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The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint von Chang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H., Nogita, K.

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Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint von Somidin, Flora, Maeno, Hiroshi, Tran, Xuan Quy, D McDonald, Stuart, Mohd Salleh, Mohd Arif Anuar, Matsumura, Syo, Nogita, Kazuhiro

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GROWTH REVIVAL OF GREY OYSTER (PLEUROTUS PULMONARIUS) POWDER CULTURE MUSHROOM FROM THE EFFECT OF SPRAY DRYING TEMPERATURE von Zakaria, Zarina, Aziz, Fatihah, Md Sarip, Mohd Sharizan, Mohd Salleh, Noor Hasyierah

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The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy von Chang, M.S., Salleh, M.A.A. Mohd, Halin, D.S.C., Ramli, M.I.I., Yasuda, H., Nogita, K.

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The effect of corrosion on the capability of asphalt mortar to induce healing via microwave heating system von Mohd Ghazali, Mohd Fahmi Haikal, Mohd Hasan, Mohd Rosli, Abu Seman, Anasyida, Salleh, Abdul Hakim, Mukhtar, Najib, Osman, Hanizah, Uwanuakwa, Ikenna D.

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In situ imaging of microstructure formation in electronic interconnections von Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.

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Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows von Chang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H., Nogita, K.

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Optimal Design of a Rain Gauge Network Models: Review Paper von Abu Salleh, Nor Sofiza, Mohd Aziz, Mohd Khairul Bazli, Adzhar, Noraziah

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In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates von Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D., Matsumura, S.

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The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints von Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M.A.A. Mohd, Nogita, Kazuhiro

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Development of dense void-free electrospun SPEEK-Cloisite15A membrane for direct methanol fuel cell application: Optimization using response surface methodology von Awang, N., Jaafar, Juhana, Ismail, A.F., Othman, M.H.D., Rahman, Mukhlis A., Yusof, N., Aziz, F., Salleh, W.N.W., Suradi, S.S., Ilbeygi, H., Wan Mohd Noral Azman, W.N.E., Arthanareeswaran, G.

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The economic well-being of smallholders and challenges during COVID-19 pandemic: A review von Binti Mohd Suib, Nurul Atiqah, Salleh, Norlida Hanim Mohd, Ahmad, Mohd Fazim

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Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method von Sonawwanay, Puskaraj D., Bupesh Raja, V. K., Mohd Salleh, M. A. A., Muhammad, Noorhafiza Binti, Nazri, S. F., Gupta, Manoj

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Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) von Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H., Nogita, K.

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